Sensing Unit Support Layout for Larger Absorption Area
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Solution Overview
Problem
Existing sensing devices have a limited sensing area due to the positioning of the supporting part, which affects the absorption rate of the sensing part.
Innovation Solution
A sensing device is designed with a substrate and a circuit layer, where the supporting part is electrically connected to driving circuits and the sensing part is separated from a cavity by the supporting and circuit layers, allowing for increased sensing area by positioning at least a portion of the supporting part between the circuit layer and the sensing part.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the supporting part is disposed close to the sensing part to improve absorption rate, then the absorption rate is improved, but the sensing area is limited
Solution Approach 1:
The supporting part is positioned in the vertical dimension (between the circuit layer and sensing part) rather than occupying horizontal space, allowing the sensing area to extend across the entire top surface without being constrained by the supporting structure's footprint
2Area of moving object
If the supporting part is positioned to maximize sensing area, then the sensing area is increased, but the absorption rate decreases
Solution Approach 1:
The supporting part is strategically positioned only in the vertical region between the circuit layer and sensing part, providing localized support and electromagnetic coupling enhancement without occupying horizontal sensing space, thus maintaining both large sensing area and high absorption rate
Data Source
AI summary
A sensing device including a substrate, a circuit layer, and a plurality of sensing units is provided. The circuit layer is disposed on the substrate and includes a plurality of driving circuits. The plurality of sensing units are disposed on the circuit layer, and each of the sensing units includes a supporting part and a sensing part. The supporting part is electrically connected to one of the plurality of driving circuits. The sensing part is electrically connected to the supporting part, and the sensing part is separated from a first cavity by the supporting part and the circuit layer. In a normal direction of the substrate, at least a portion of the supporting part is disposed between the circuit layer and the sensing part.