Microneedle Patch With Bump Array For Stress Absorption

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Microneedle patches face issues with needle breakage, bending, or fracture, which affects the integrity and dosage accuracy of medicament delivery, particularly in applications requiring controlled dosages.

Innovation Solution

A transdermally deliverable microneedle patch design featuring a basal layer with a microneedle array and a bump array, where microneedles are made of a medicament and a dissolvable carrier, and bumps are arranged around the microneedle array to absorb and redirect stress, reducing the risk of damage and ensuring accurate dosage delivery.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If microneedles are made with small diameters for transdermal delivery, then penetration capability is improved, but susceptibility to breakage and fracture increases

Engineering Contradiction:

Improvemicroneedle diameterVSAvoidmicroneedle integrity

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent introduces a bump array surrounding the microneedle array that acts as a protective cushion. The bumps absorb external stresses and impacts before they can reach the microneedles, preventing breakage while maintaining the microneedles' small diameter for effective skin penetration and medicament delivery.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The bump array serves as an intermediary protective layer between external forces and the microneedles. This mediator structure absorbs and redistributes mechanical stresses, protecting the fragile microneedles from direct impact while allowing the microneedles to maintain their delicate, small-diameter structure for effective transdermal delivery.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If microneedles are made fragile for precise dosage control, then dosage accuracy is improved, but resistance to mechanical damage decreases

Engineering Contradiction:

Improvedosage accuracyVSAvoidmicroneedle strength

Core Design Contradiction:

Measurement precisionVSStrength

Solution Approach 1:

The bump array provides beforehand cushioning protection that allows microneedles to be made with precise, controlled dimensions for accurate dosage delivery. The protective bumps compensate for the reduced mechanical strength inherent in precisely engineered, small-diameter microneedles, ensuring both dosage accuracy and mechanical durability.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Productivity

If microneedles are arranged in a dense array for effective medicament delivery, then delivery efficiency is improved, but vulnerability to collective damage increases

Engineering Contradiction:

Improvemedicament delivery efficiencyVSAvoidsusceptibility to damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The bump array acts as an intermediary protective structure that surrounds and protects the dense microneedle array. This mediator layer distributes external stresses across multiple bumps rather than concentrating forces on individual microneedles, allowing the microneedles to be arranged in a dense configuration for efficient medicament delivery without increased vulnerability to collective damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the risk of microneedle damage and ensures accurate medicament delivery by using bumps to absorb stress, maintaining the structural integrity and dosage accuracy of the microneedles, thus enhancing the convenience and precision of transdermal medicine delivery.

Implementation Method 1

the microneedles are made of a predetermined medicament and a first dissolvable carrier component

Methodology Applied

Scientific EffectDissolution: Deliquescence

Data Source

PatentUS20240091515A1Microneedle patch, manufacturing mold therefor, and manufacturing method therefor

Publication Date: 2024.03.21 DARWIN PRECISIONS CORP

AI summary

The present invention provides a transdermally deliverable microneedle patch, a manufacturing mold therefor, and a manufacturing method therefor. The transdermally deliverable microneedle patch includes: a basal layer for attaching to an epidermis, and a microneedle array and a bump array arranged on the basal layer. The microneedle array includes a plurality of microneedles that protrude and extend away from the basal layer. The microneedles are made of a predetermined medicament and a first dissolvable carrier component, and diameters of ends of the microneedles opposite to the basal layer are less than 50 μm. The bump array includes a plurality of bumps that protrude and extend away from the basal layer. Diameters of ends of the bumps opposite to the basal layer are greater than 50 μm. The bumps are arranged at intervals along a periphery of the microneedle array, and heights by which the bumps protrude from the basal layer are less than heights by which the microneedles protrude from the basal layer.