Microneedle Patch Assembly Using Multiple Dies for Larger Arrays
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Solution Overview
Problem
Existing methods for producing microneedle arrays are limited by the size of the dies used, which restricts the size of the microneedle arrays, necessitating multiple applications for larger applications.
Innovation Solution
A device comprising a die with depressions for forming microstructures, a support layer with an adhesive, and a lifting device for pressing and demolding microneedle arrays onto the support layer, allowing for the production of a patch with multiple microneedle arrays simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single die is used for producing microneedle arrays, then the production process is simple, but the size of the microneedle array is limited to 1-2 cm²
Solution Approach 1:
The invention divides the microneedle array production into multiple segments by using several dies simultaneously. Each die produces a portion of the microneedle array, and all dies work in parallel to create a large-scale array on a single support layer, thereby overcoming the size limitation of individual dies while maintaining production efficiency.
Solution Approach 2:
The invention combines multiple dies and their corresponding microneedle arrays onto a single support layer. By integrating multiple production units (dies) into one system, the invention achieves large-scale microneedle array production without requiring multiple separate applications, thus resolving the contradiction between process simplicity and array size.
2Area of stationary object
If multiple individual microneedle arrays are applied to achieve larger coverage, then the application area is increased, but the number of applications and time required increases
Solution Approach 1:
The invention segments the large microneedle array into multiple smaller units produced by individual dies, but all segments are created simultaneously in one production cycle. This allows the final patch to cover a large area while requiring only a single application, eliminating the time loss associated with multiple separate applications.
Solution Approach 2:
The invention performs preliminary action by pre-arranging multiple microneedle arrays on a single support layer before the application step. This preliminary arrangement of multiple arrays on one patch enables large-area coverage to be achieved in a single application, rather than requiring multiple sequential applications of individual arrays.
3Area of stationary object
If the die size is increased to produce larger microneedle arrays, then the array size is improved, but the shaping and handling of the die becomes difficult
Solution Approach 1:
Instead of creating one large die that is difficult to shape and handle, the invention segments the production into multiple smaller dies of manageable size. Each small die can be easily manufactured and handled, yet collectively they produce a large microneedle array, resolving the contradiction between array size and die manufacturability.
Solution Approach 2:
The invention transitions from a single-dimension approach (one large die) to a multi-dimensional arrangement by positioning multiple small dies in a spatial configuration on the support layer. This dimensional change allows the system to achieve large overall array size while maintaining small, manageable individual die sizes that are easy to manufacture and handle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient production of a patch with multiple microneedle arrays by allowing simultaneous arrangement and adhesion of microneedle arrays onto a support layer, overcoming the limitations of die size constraints.
Implementation Method 1
a support layer (26) with an adhesive layer (34), against which the microneedle array is pressed, such that the microneedle array adheres to the support layer
Data Source
AI summary
A device for producing a patch which includes a plurality of microstructures has at least one die. The die is used to produce a microstructure and has a plurality of depressions for this purpose. Additionally, a support layer, which is provided with an adhesive layer, is provided. In a preferred embodiment, it is possible to move the microstructure formed in the die in the direction of the support layer using a lifting device such that said microstructure adheres to the face of the support layer, which is provided with the adhesive layer. For example, by carrying out a corresponding method multiple times, multiple microstructures can be provided on the support layer adjacently to one another. Optionally, multiple dies can also be provided so that multiple microstructures can be simultaneously arranged on the support layer.