Microphone Package Temperature Sensor Placement
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Solution Overview
Problem
Integrated temperature sensors in miniature circuits face inaccuracies due to the 'miniature heat island effect' caused by the integrated circuit itself, which interferes with ambient air temperature readings.
Innovation Solution
An integrated temperature sensor and microphone package design where the temperature sensor is placed near or over the acoustic port, utilizing a thermocouple or thermally conductive channel to minimize heat interference, allowing for accurate ambient temperature detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the temperature sensor is integrated into the integrated circuit, then the device complexity is reduced and manufacturing is simplified, but the measurement precision deteriorates due to heat interference from the circuit
Solution Approach 1:
The temperature sensor is extracted from the integrated circuit substrate and placed on a separate acoustic port structure. This physical separation removes the sensor from the heat-generating circuit environment while maintaining integration benefits through coordinated packaging and shared functionality with the acoustic port.
Solution Approach 2:
The acoustic port structure serves as an intermediary element that hosts the temperature sensor away from the heat source. The port acts as a thermal buffer zone, allowing the sensor to measure ambient temperature without direct thermal coupling to the integrated circuit while still being part of the same packaged device.
2Volume of moving object
If the temperature sensor is placed close to the integrated circuit for integration purposes, then the device size is reduced, but the temperature reading accuracy worsens due to the miniature heat island effect
Solution Approach 1:
The acoustic port structure creates a localized thermal environment that is distinct from the integrated circuit heat source. By positioning the temperature sensor within this locally engineered acoustic port cavity, the sensor experiences a different thermal regime than if it were directly on the circuit substrate, enabling accurate ambient temperature measurement while maintaining compact overall device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the accuracy and sensitivity of temperature readings by isolating the temperature sensor from the heat generated by the integrated circuit, providing more reliable ambient air temperature measurements.
Implementation Method 1
utilizing a thermocouple or thermally conductive channel to minimize heat interference
Implementation Method 2
utilizing a thermocouple or thermally conductive channel to minimize heat interference
Data Source
AI summary
Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.