Microprocessor Carrier Lever Wedge Release Mechanism

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Solution Overview

Problem

The existing methods for loading microprocessors into sockets require high forces to ensure electrical connections are stable, which can damage the microprocessor and heatsink due to the adhesion of thermal interface material, making removal difficult and prone to causing damage to surrounding electronics.

Innovation Solution

A microprocessor carrier with a microprocessor release mechanism featuring a lever articulating on its frame and a wedge extending into the carrier, allowing for controlled separation from the heatsink, and anti-tilt fastener assemblies that maintain parallelism between the heatsink and motherboard to distribute loads evenly, preventing tilting and damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If thermal interface material is applied between microprocessor and heatsink to enhance heat transfer, then heat transfer efficiency is improved, but adhesion between microprocessor and heatsink increases making removal difficult

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidease of removal

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The patent introduces a release mechanism that segments the removal process into controlled steps. The lever system allows the microprocessor to be detached in a controlled manner rather than requiring direct forceful separation, thus overcoming the adhesion created by thermal interface material without damaging components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs a release mechanism as an intermediary tool between the operator and the adhered microprocessor. This intermediary device (comprising lever, pivot, and wedge) translates minimal user force into sufficient separation force while maintaining control, solving the problem of removing the microprocessor despite strong adhesion from thermal interface material.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If large forces are applied to load microprocessor into socket to ensure stable electrical connections, then connection stability is improved, but damage to microprocessor and heatsink increases

Engineering Contradiction:

Improveconnection stabilityVSAvoidcomponent integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies preliminary action by pre-positioning the microprocessor using alignment features (alignment pins and holes) before applying loading forces. The anti-tilt fasteners are also pre-configured to engage with the socket, ensuring proper positioning and load distribution before the microprocessor is fully seated, thereby achieving stable connections with reduced risk of damage.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the parameter of force distribution by introducing anti-tilt fasteners that distribute loading forces across multiple contact points. This transforms the force application from concentrated to distributed, maintaining connection stability while reducing peak stresses that could damage the microprocessor or heatsink.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If anti-tilt fastener assemblies are used to maintain parallelism between heatsink and motherboard, then load distribution is improved, but device complexity increases

Engineering Contradiction:

Improveload distribution uniformityVSAvoidfastener assembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the anti-tilt fastener assembly: positioning, tilting prevention, and load distribution are all achieved through this single integrated component. The fastener assembly combines alignment features, anti-tilt geometry, and load-bearing capacity, reducing the need for separate components while improving load distribution uniformity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution facilitates easy and damage-free removal of microprocessors by reducing the force required to break adhesion and ensures uniform load distribution, protecting the microprocessor and adjacent electronics during installation and removal.

Implementation Method 1

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Implementation Method 2

Often, a thermal interface material (TIM) is needed to enhance heat transfer between the microprocessor IHS and the heatsink

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Implementation Method 3

Under pressure of the load, the TIM layer develops adhesive bonds between the microprocessor and heatsink and is difficult to release

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11296009B2Method and apparatus for detaching a microprocessor from a heat sink

Publication Date: 2022.04.05 INTEL CORP

AI summary

A microprocessor carrier comprising a lever having an elongate arm and a wedge structure extending from one end of the elongate arm, and a frame comprising and a fulcrum structure to receive the lever and a microprocessor. The fulcrum structure is to couple the lever to the frame.