Microstrip Isolation Structure for Crosstalk Reduction

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Solution Overview

Problem

Conventional methods fail to effectively eliminate crosstalk between microstrip transmission lines, especially in high-frequency and high-speed circuits, as they either increase common mode signals or require additional ground lines that are ineffective at blocking mutual inductance.

Innovation Solution

A microstrip isolation structure is created by etching periodic subwavelength indentation structures along the lateral sides of microstrip lines and connecting resistors to these lines, which increases self-inductance and confines the magnetic field, reducing crosstalk through mutual inductance and mode conversion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the interval between adjacent microstrip lines is increased to reduce crosstalk, then crosstalk is reduced, but the package size increases

Engineering Contradiction:
ImprovecrosstalkVSAvoidpackage size
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The microstrip line is segmented by etching periodic subwavelength indentation structures along its lateral sides, creating multiple isolated sections that disrupt electromagnetic coupling between adjacent lines. This segmentation allows maintaining small spacing while reducing crosstalk, as the indentations break the continuous current path and reduce mutual inductance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The indentation structures are strategically placed only at critical coupling points between adjacent microstrip lines, applying isolation measures locally rather than uniformly across the entire transmission line. This localized approach reduces crosstalk where needed while minimizing impact on overall package size.

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If conventional isolation methods are used, then some crosstalk reduction is achieved, but mutual inductance cannot be effectively blocked

Engineering Contradiction:
ImprovecrosstalkVSAvoidisolation effectiveness
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The solution extends the isolation approach from the traditional horizontal spacing dimension to the vertical dimension by etching indentations into the microstrip line structure. This creates a three-dimensional isolation effect that blocks mutual inductance more effectively than conventional two-dimensional spacing methods.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The periodic indentation structures act as intermediary elements between adjacent microstrip lines, disrupting the direct electromagnetic coupling path. These indentations serve as isolation mediators that reduce mutual inductance without requiring increased spacing between the transmission lines.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If signal rising time or falling time is increased to reduce crosstalk, then crosstalk is reduced, but transmission speed decreases

Engineering Contradiction:
ImprovecrosstalkVSAvoidtransmission speed
Core Design Contradiction:
Object-affected harmful factorsVSSpeed

Solution Approach 1:

The periodic indentation structures are pre-configured along the microstrip line to proactively reduce mutual inductance before crosstalk can significantly affect signal integrity. This preliminary structural modification allows maintaining fast signal edges without excessive crosstalk, eliminating the need to slow down transmission.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively isolates microstrip transmission lines, reducing crosstalk and mode conversion, particularly in high-frequency circuits, and is more effective than conventional methods as it strengthens isolation with increasing frequency.

Implementation Method 1

The microstrip line can introduce the current distributed over the edges into indentation structures periodically formed along lateral sides of the microstrip line so as to form an approximately closed loop, which is favorable to increase the self-inductance of the circuit and confine the magnetic field around the microstrip transmission lines

Methodology Applied
Scientific EffectSelf-inductance: Inductor

Implementation Method 2

confine the magnetic field around the microstrip transmission lines thereby effectively reducing the crosstalk due to the mutual inductance between the adjacent microstrip transmission lines

Methodology Applied
Scientific EffectMagnetic field confinement: Magnetic Field

Implementation Method 3

the resistors coupled to the microstrip line having periodic subwavelength configuration can effectively conduct electrical signals into ground

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10090574B2Microstrip isolation structure for reducing crosstalk
Publication Date: 2018.10.02 WU CHIA HO
  • US10090574B2 patent drawing
  • US10090574B2 patent drawing
  • US10090574B2 patent drawing

AI summary

The present invention provides a microstrip isolation structure for reducing crosstalk, comprising a microstrip line and two grounded resistors. The microstrip line comprises a plurality of indentation structures arranged periodically. The two grounded resistors are connected to two ends of the microstrip line, respectively. The plurality of indentation structures are periodically arranged in a subwavelength configuration that a period length of the plurality of indentation structures is far smaller than a wavelength of a transmission signal generated by a crosstalk around the microstrip line, whereby impingement of electromagnetic wave is confined by the plurality of indentation structures.