Stacked waveguide networks route RF power to specific loads through phase modulation, reducing layout complexity.
A microstrip isolation structure uses periodic subwavelength indentations and grounded resistors to confine magnetic fields.
Impedance transforming attenuator adjusts reference impedance to enable wider transmission lines for compact directional couplers.
Additive manufacturing produces three-dimensional waveguides with arbitrary geometries, resolving high signal loss at narrow angles in compact spaces.
Ridge-based filters segment mm-wave signals to reduce dispersion, boosting data rates while lowering power consumption.
A dielectric waveguide-path device guides electromagnetic waves using controlled refractive indices and electrode arrangements.
A dielectric waveguide uses a columnar conductor to optimize electromagnetic mode conversion within the guide region.
A directional coupler uses coupling metal segments with gradually changing widths to achieve high directivity.
Composite material-filled vias minimize electromagnetic field reflections and leakage by tuning substrate permittivity.
Cascaded directional couplers with broadside tracks create symmetric ports, eliminating interspersed configurations that cause unwanted phase changes.
A divider uses a bridging assembly to manage signal flow and impedance matching across multiple nodes.
Integrally formed waveguide assembly merges multiple ports into a single structure, reducing spatial footprint and weight penalties in satellite payloads.
Bending quarter-wavelength open stubs generates transmission zeros that enhance out-band rejection while reducing occupied PCB area.
A constraint layer with waveguide cavities couples LCP and HTCC substrates via CTE matching, reducing thermal sensitivity and interface complexity.
A plate-shaped ridge structure connects a transmission line to a waveguide at a gentle angle, enabling direct signal transfer without additional bending.
A modular waveguide connector transmits millimeter-wave signals through a curved path without bending the guide.
Segmented transmission lines with interconnecting resistors resolve the isolation bandwidth trade-off, delivering constant coupling and high directivity.
Twist transition device orients electromagnetic fields across discrete stages to resolve phase errors from dimensional variations.
Segmented conductor tracks merge with waveguide walls on a single layer, eliminating multi-layer transitions and maintaining shielding effectiveness.
Conventional printed circuit board techniques fabricate the assembly, eliminating complex metallic cavity structures while maintaining low insertion loss.
An air gap between the waveguide end surface and antenna reduces insertion losses, enhancing stability and positioning accuracy.
Stacked conductor patterns on a flexible substrate control characteristic impedance while maintaining bond strength and reducing insertion loss.
Parallel transmission lines in a dual-band filter reduce electromagnetic interference while maintaining low insertion loss across 2.45 and 5 GHz bands.
A dummy load combines a resistive termination with a coaxial cable to dissipate RF power across wide bandwidths.
Segmenting the through line reduces insertion losses and coupling losses while minimizing area occupied by the RF coupler.
Nested coaxial conductors reduce device complexity while achieving broadband operation through multiple resonant modes.
E-fuses configure phase shifters in antenna arrays to set beam direction, eliminating signal attenuation from active tuning.
A dielectric stub coupler launches guided electromagnetic waves along a transmission medium at millimeter-wave frequencies.
A filtering circuit uses cross-coupling between non-adjacent resonators to transmit signals and suppress sideband interference.
Bent corner electrodes stabilize high-frequency ground potential without a cover, resolving trade-offs between reliability and device complexity.
A power divider uses electromagnetically coupled transmission lines to split signals efficiently.
Intra-layer proximity and inter-layer overlap create a double coupling space that reduces insertion loss in compact mobile devices.