Microstructure Wound Closure Devices for Minimally Invasive Skin Sealing
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Solution Overview
Problem
Conventional wound closure methods, such as sutures and staples, are invasive, painful, and can lead to scarring, require follow-up care, and may cause allergic reactions due to adhesives, while adhesive-based bandages are inadequate for severe wounds and prone to premature release due to skin moisture.
Innovation Solution
The development of wound closure devices featuring microstructures that can penetrate or grasp skin, secured without adhesives, designed for easy application and removal, minimizing inflammation and scarring, and capable of delivering therapeutic agents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sutures and staples are used for wound closure, then effective wound closure is achieved, but the procedure becomes invasive and painful requiring anesthetics
Solution Approach 1:
The patent changes the physical parameters of the closure device by using microstructures with dimensions in the micrometer range (e.g., 10-100 μm needle diameter) rather than macroscopic sutures or staples. This parameter change allows the device to penetrate skin effectively while minimizing damage to nerve endings and blood vessels, thereby reducing pain and invasiveness while maintaining wound closure effectiveness
Solution Approach 2:
The wound closure device is segmented into multiple microstructures (needles, pins, or spikes) arranged in arrays rather than using a single large suture or staple. This segmentation allows distributed penetration and closure forces across multiple points, reducing the mechanical stress and tissue damage at any single location, thereby decreasing pain and invasiveness while achieving reliable wound closure
2Reliability
If sutures and staples are used for wound closure, then effective wound closure is achieved, but scarring increases due to secondary insertion holes and tension variations
Solution Approach 1:
The patent uses microstructures with diameters of 10-100 μm, which are below the threshold for significant scarring. The microscale dimensions create minimal disruption to skin architecture and reduce the visibility of insertion points. Additionally, the uniform distribution of microstructures ensures even tension application, preventing the stress concentration that leads to scar formation
Solution Approach 2:
The device creates numerous microscopic copies of insertion points rather than a few large ones. The array of microstructures produces many tiny puncture sites that are collectively less visible and less scarring than the fewer, larger insertion holes created by traditional sutures or staples
3Object-affected harmful factors
If adhesive-based bandages are used for wound coverage, then wound protection is provided, but adherence is reduced by skin moisture leading to premature release
Solution Approach 1:
The patent replaces the chemical adhesion mechanism (adhesive bonding) with a mechanical anchoring mechanism. Microstructures penetrate the skin and surrounding tissue to create physical interlocking and friction-based attachment. This mechanical substitution eliminates the negative interaction between moisture and adhesion, as the mechanical grip is not compromised by skin moisture in the same way chemical adhesives are
4Object-affected harmful factors
If adhesive-based bandages are used for wound coverage, then wound protection is provided, but allergic and inflammatory reactions are induced
Solution Approach 1:
The patent substitutes chemical adhesion (adhesive materials that can cause allergic reactions) with mechanical anchoring through skin penetration. The microstructures create attachment through physical interlocking rather than chemical bonding, eliminating the immunogenic components of adhesives that trigger allergic and inflammatory responses while maintaining wound protection
5Ease of repair
If follow-up visits are required for suture and staple removal, then proper wound care is ensured, but loss of time and increased complexity occur
Solution Approach 1:
The patent designs the microstructure-based device to be self-removing or easily removable by the patient without professional assistance. The microstructures are engineered to lose grip as the wound heals and contracts, or can be simply pulled off without causing damage. This self-service capability eliminates the need for follow-up removal visits, reducing time loss and visit complexity while maintaining adequate wound care through the device's designed retention characteristics
Data Source
AI summary
The present invention relates generally to wound closure devices comprising one or more microstructures. The devices are designed such that the microstructures are able to grip the skin or tissue surrounding a wound, optionally closing the wound, or securing the tissue or skin in place. Also provided are wound closure systems that comprise one or more microstructure wound closure devices along with other components, such as protective covers and wound healing therapeutics. A variety of packaging specifications are disclosed, as is a dispenser apparatus configured to enable simple one-handed application of the wound closure devices. Methods described herein provide for the closure of various wounds with the wound closure devices and systems.