Microswitching Element With Closed-End Slits
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Solution Overview
Problem
Conventional MEMS switches face challenges in achieving low insertion loss and sufficient low resistance due to limitations in forming thick fixed contact electrodes, which can lead to issues with the sacrificial layer breaking and improper formation of movable and fixed contact portions during fabrication.
Innovation Solution
The microswitching element design eliminates the need for forming fixed contact electrodes on the base substrate, allowing for thicker electrodes to be deposited on the opposite side via the movable portion, using a layered structure and electroplating, and incorporating a slit with closed ends to suppress high-frequency signal leakage, while avoiding detachment of the movable contact portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick fixed contact electrodes are formed on the base substrate to reduce insertion loss, then resistance characteristics improve, but the sacrificial layer breaks and fabrication becomes problematic
Solution Approach 1:
Instead of forming fixed contact electrodes on the base substrate (conventional approach), the patent inverts the process by forming thick fixed contact electrodes on the opposite side of the base substrate through the movable portion. This allows achieving low resistance (improving reliability) without causing sacrificial layer breakage during fabrication (resolving manufacturing difficulties).
Solution Approach 2:
The patent changes the spatial dimension of electrode formation from the base substrate surface to the opposite side through the movable portion. This dimensional shift enables the formation of thick electrodes (5 μm or more) that would otherwise break the sacrificial layer, thus reducing insertion loss while maintaining fabrication feasibility.
2Reliability
If thick fixed contact electrodes are formed to reduce insertion loss, then electrical performance improves, but manufacturing precision deteriorates due to sacrificial layer breaking
Solution Approach 1:
The patent inverts the electrode formation location from the base substrate to the opposite side through the movable portion. This allows thick electrodes (5 μm or more) to be formed without breaking the sacrificial layer, thereby achieving low insertion loss (improving reliability) while maintaining precise formation of contact portions (preserving manufacturing precision).
Solution Approach 2:
The movable portion is formed first as a suspended structure with closed-end slits, creating a protected environment. Then thick fixed contact electrodes are formed through this movable portion before sacrificial layer removal. This preliminary structuring prevents sacrificial layer breakage during thick electrode formation, ensuring both low insertion loss and precise contact portion formation.
3Ease of operation
If fixed contact electrodes are formed on the base substrate, then switching function is achieved, but high-frequency signal leakage occurs
Solution Approach 1:
The patent segments the base substrate by forming closed-end slits that extend from the peripheral surface toward the opposite side. These slits divide the base substrate into isolated regions, preventing high-frequency signals from leaking through the base substrate while allowing the switching function to operate normally through the movable contact portion and fixed contact electrodes.
Solution Approach 2:
The patent moves the fixed contact electrodes from the base substrate surface to the opposite side through the movable portion. This dimensional relocation, combined with closed-end slits in the base substrate, creates electromagnetic shielding that prevents signal leakage while maintaining the switching function through the movable contact mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the fabrication of microswitching elements with reduced insertion loss and improved resistance characteristics by allowing thicker fixed contact electrodes and precise air gap formation, while minimizing the risk of electrode detachment and signal leakage.
Implementation Method 1
allowing for thicker electrodes to be deposited on the opposite side via the movable portion, using a layered structure and electroplating
Implementation Method 2
incorporating a slit with closed ends to suppress high-frequency signal leakage
Implementation Method 3
When a prescribed electric potential is supplied to the drive electrode 606 of a microswitching element X6 with this constitution, an electrostatic force of attraction is produced between the drive electrodes 606 and 607
Data Source
AI summary
A microswitching element includes a base substrate, a fixing portion attached to the base substrate, and a movable portion including a fixed end fixed to the fixing portion. The movable portion is surrounded by the fixing portion via a slit having a pair of closed ends. The movable portion includes a first surface and a second surface. The first surface faces the base substrate, and the second surface is opposite to the first surface. The microswitching element also includes a movable contact portion provided on the second surface of the movable portion, and a pair of fixed contact electrodes each including a contact surface facing the movable contact portion. The fixed contact electrodes are attached to the fixing portion.