Chlorine etch-back and fluorine plasma conditioning lower ruthenium MEMS contact resistance while reducing stiction risk over device life.
An electroactive polymer interconnect shifts particle contact states to maintain conductivity and prevent switch glitches during thermal cycling.
Offset pull-down electrodes break the off-state capacitive path in MEMS switches, improving isolation and reducing electrical loss.
A two-stage electrostatic actuator bends a switch beam to cut closure oscillations and impact velocity, improving contact stability and lifespan.
Fringing-field actuation bends the switch beam with controlled electrostatic force to cut oscillations, lower contact speed, and extend switch life.