Microwave Plasma Unit Groove Layout for Uniform Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses suffer from non-uniform plasma density distribution, leading to inconsistent processing results such as varying etching rates and annealing degrees across the substrate, due to structural limitations in adjusting plasma density.
Innovation Solution
Incorporation of adjustment grooves on the upper plate beneath the antenna plate to modify the electric field distribution, allowing precise control of plasma density uniformity by varying groove depth and position relative to the antenna slots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the slot shape, position, and distribution in the antenna plate are changed to adjust plasma density, then plasma density uniformity is improved, but structural limitations prevent further optimization
Solution Approach 1:
The invention divides the upper plate into multiple regions with different groove depths. By segmenting the plate structure and varying the groove depth in different regions, the electric field distribution is optimized to achieve more uniform plasma density across the substrate processing area, overcoming the limitations of uniform groove designs.
2Manufacturing precision
If the transmissive plate shape is changed to adjust plasma density, then plasma density distribution is improved, but particle generation occurs
Solution Approach 1:
The invention applies local quality by creating regions with different groove depths in the upper plate. This localized variation in groove depth allows precise control of electric field distribution and plasma density in specific areas without changing the overall transmissive plate shape, thereby avoiding particle generation while achieving uniform plasma density.
3Manufacturing precision
If groove depth in the upper plate is increased to adjust electric field, then plasma density uniformity is improved, but manufacturing complexity increases
Solution Approach 1:
The invention changes the geometric parameter of the upper plate by varying groove depth across different regions. This parameter variation allows control of electric field distribution and plasma density uniformity. The grooves can be formed using standard semiconductor manufacturing techniques, making the solution practically implementable despite the parameter variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves substrate processing efficiency and uniformity by ensuring consistent plasma density across the processing space, enhancing etching and annealing processes.
Implementation Method 1
a microwave application unit configured to generate plasma from the processing gas supplied to the processing space
Implementation Method 2
generate plasma from processing gas by using a microwave in the processing space 12
Implementation Method 3
an adjustment groove configured to adjust an electric field may be formed on an lower surface of the upper plate
Data Source
AI summary
Disclosed is a microwave application unit for applying a microwave to generate plasma. The microwave application unit includes an antenna plate disposed on the support unit and having a plurality of slots; a power supply configured to apply a microwave to the antenna plate; a dielectric plate disposed above the antenna plate to face the antenna plate; an upper plate disposed above the dielectric plate; and a transmissive plate provided below the antenna plate and configured to transmit the microwave to the processing space, wherein an adjustment groove configured to adjust an electric field is formed on an lower surface of the upper plate.