Microwave Signal Transition Component Impedance Control
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Solution Overview
Problem
Existing microwave signal transitions in printed circuit boards are bulky, costly, and difficult to manufacture robustly with accurate impedance matching, leading to high losses and excessive radiation.
Innovation Solution
A compact microwave signal transition component featuring an electrically conducting plating within a dielectric filling aperture, connected to signal conductor planes, providing coaxial or balanced transitions with reduced radiation and low manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal plated via holes are used for microwave signal transitions, then electrical connection between signal conductor planes is achieved, but impedance matching becomes difficult and microwave radiation increases
Solution Approach 1:
A dielectric filling material is introduced as an intermediary substance within the via hole, surrounded by electrically conducting plating. This intermediary dielectric structure enables precise impedance control and reduces microwave radiation by providing a controlled electromagnetic environment, replacing the problematic direct metal-to-metal via hole connection.
2Object-generated harmful factors
If grounded via holes are added around signal via holes to reduce radiation, then microwave radiation is reduced, but area consumption and manufacturing complexity increase
Solution Approach 1:
The harmful radiation problem is extracted and solved by introducing a specialized dielectric filling structure with conducting plating directly within the signal via hole itself, rather than adding separate grounded via holes around it. This extracts the radiation control function from the surrounding area and concentrates it within the via hole structure.
3Reliability
If via hole size and length are adjusted to match impedance, then impedance matching improves, but manufacturing precision requirements increase
Solution Approach 1:
The impedance matching is achieved by changing the parameters of the dielectric filling material (such as dielectric constant) and the conducting plating configuration, rather than relying solely on precise control of via hole size and length. This allows impedance matching through material selection and structural design, reducing sensitivity to manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, cost-effective, and robust signal transition with precise impedance matching, reducing losses and unwanted radiation across the millimeter wave spectrum from DC to 300 GHz.
Implementation Method 1
electrically conducting plating that at least partly covers the inner surface of said filling aperture
Implementation Method 2
dielectric filling (5) positioned within said conducting frame (4) and one filling aperture (6) running through said dielectric filling (5)
Data Source
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AI summary
The present invention relates to a microwave signal transition component (1) having a first signal conductor side (2) and a second signal conductor side (3). The signal transition component (1) is arranged for transfer of microwave signals from the first signal conductor side (2) to the second signal conductor side (3). The transfer component (1) comprises at least one, at least partly circumferentially running, electrically conducting frame (4), a dielectric filling (5) positioned at least partly within said conducting frame (4), at least one filling aperture (6; 6a, 6b) running through the dielectric filling, and, for each filling aperture (6; 6a, 6b), an electrically conducting connection (7; 7a, 7b) that at least partly is positioned within said filling aperture (6; 6a, 6b). The present invention also relates to a method for manufacturing a microwave signal transition component according to the above.