3D MID Holding Member With Grounded Overlap for Endoscope Signals
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Solution Overview
Problem
Conventional electronic component holding members in resin molded products face challenges in forming circuit wiring on non-planar surfaces and managing electromagnetic interference, leading to signal degradation and noise susceptibility.
Innovation Solution
The use of a two-stage Molded Interconnect Device (MID) technique to form first and second resin molded products with non-planar metal patterns, where the second metal pattern overlaps and grounds the first, connected by grounding wiring, enabling impedance control and noise resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If circuit wiring is formed on non-planar surfaces using conventional techniques, then the electronic component can be held in the resin molded product, but signal degradation and noise susceptibility occur
Solution Approach 1:
The patent transitions from conventional two-dimensional planar circuit wiring to three-dimensional non-planar surface wiring on the resin molded product. The metal patterns are formed on the curved surface of the distal end portion, enabling compact integration while maintaining signal integrity through controlled impedance pathways that follow the surface geometry.
Solution Approach 2:
The patent introduces a grounding pattern as an intermediary element between the signal carrying metal patterns and the external environment. This grounding pattern, formed on the same non-planar surface, provides a reference potential and shields the signal patterns from external electromagnetic interference, reducing noise susceptibility.
2Object-affected harmful factors
If grounding wiring is added to manage electromagnetic interference, then noise resistance improves, but device complexity increases
Solution Approach 1:
The patent merges the grounding function with the existing resin molded product structure by forming the grounding pattern directly on the curved surface of the distal end portion. The grounding wiring is integrated into the same molded component as the signal carrying metal patterns, eliminating the need for separate grounding structures or additional assembly steps.
Solution Approach 2:
The resin molded product's curved surface serves multiple functions: it provides the mechanical structure for holding the electronic component, serves as the substrate for forming both signal carrying metal patterns and grounding patterns, and provides the geometric pathway for impedance-controlled signal transmission. This multi-functionality reduces overall device complexity.
3Volume of moving object
If metal patterns are formed on curved surfaces, then compact endoscope design is achieved, but manufacturing precision becomes more difficult
Solution Approach 1:
The patent replaces conventional planar PCB manufacturing processes with a molding process where metal patterns are formed directly on the curved surface of the resin molded product. This allows the complex three-dimensional geometry to be created through the molding process itself rather than requiring separate mechanical formation steps, improving manufacturability.
Solution Approach 2:
The patent uses a composite structure combining resin material with embedded metal patterns formed on its curved surface. This composite approach allows the metal patterns to be formed as part of the molding process, leveraging the resin's ability to take complex three-dimensional shapes while providing a stable substrate for precise metal pattern formation.
Data Source
AI summary
An electronic component holding member includes a first base material including an electronic component, a first resin molded product, and first metal patterns in which a signal pattern and a grounding pattern are formed on a non-planar surface, a second base material including a second resin molded product, and a second metal pattern formed on a non-planar surface so as to overlap at least part of the first metal patterns, and grounding wiring configured to connect the grounding pattern and the second metal pattern.