MIM Capacitor Package Structure for Mounting Load Protection
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Solution Overview
Problem
Metal-insulator-metal (MIM) capacitors in semiconductor integrated circuits are prone to breakage due to loads applied via protruding terminal electrodes during mounting, which can transmit stress in the thickness direction and damage the circuit elements.
Innovation Solution
A semiconductor device design featuring a first resin body positioned between outer electrodes, with its tip end higher than the outer electrodes, to absorb loads and stabilize the capacitor element, while a module integrates this device with a wiring substrate for secure mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the terminal electrode protrudes to enable mounting connection, then the ease of operation is improved, but the strength of the capacitor element deteriorates due to load transmission causing breakage
Solution Approach 1:
A resin body is introduced as an intermediary material between the protruding terminal electrode and the capacitor element. The resin body extends beyond the outer peripheral surface of the capacitor element and is in contact with the terminal electrode, absorbing mounting loads and preventing direct stress transmission to the capacitor element, thereby resolving the contradiction between mounting ease and element strength.
2Ease of operation
If the terminal electrode is positioned to receive mounting loads, then the ease of operation is improved, but the reliability of the capacitor element deteriorates due to applied stress
Solution Approach 1:
The resin body is positioned in advance beyond the outer peripheral surface of the capacitor element to provide cushioning protection. This pre-positioned cushioning structure absorbs mounting loads before they can reach the capacitor element, ensuring the element's reliability is maintained while still allowing proper mounting connection.
Data Source
AI summary
A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrode layers on a side of the semiconductor substrate, a dielectric layer disposed between the electrode layers, a first outer electrode electrically connected to the first electrode layer and extended to the surface of the circuit layer, and a second outer electrode electrically connected to the second electrode layer and extended to the surface of the circuit layer. The first resin body is between the first and second outer electrodes in a plan view, and in sectional view, a tip end of the first resin body is positioned higher than tip ends of the first and second outer electrodes.