Mini LED Backplane with Metallic Reflective Layer for Power Reduction
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Solution Overview
Problem
Conventional PCB-based Mini LED backlight modules have high power consumption, which affects their service life and fails to meet market requirements for energy efficiency and longevity.
Innovation Solution
A backplane design featuring a metallic reflective layer with an antioxidation layer and a glass substrate, which includes a micro LED connected through conductive sub-layers and protection layers, enhancing light reflection and reducing power consumption while allowing for regional control of LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If conventional PCB-based Mini LED backlight modules are used, then the backlight module can be manufactured with standard PCB processes, but the power consumption is high which reduces service life
Solution Approach 1:
The patent changes the substrate material from conventional PCB to glass substrate, and modifies the reflective layer parameters by using specific metallization layers (Al, Ag, or Au) with controlled thickness (50-200nm). This parameter change in material composition and structure reduces power consumption while extending service life of the backlight module
Solution Approach 2:
The patent employs composite material structure consisting of glass substrate combined with metallization layers (Al/Ag/Au) and protective layers (SiO2, Si3N4, or organic protective layers). This composite structure optimizes both energy efficiency and durability, resolving the contradiction between power consumption and service life
2Loss of energy
If a metallic reflective layer is added to improve light reflection, then light utilization is improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the reflective function with the substrate structure by integrating metallization layers directly onto the glass substrate. This consolidation achieves improved light utilization (reducing energy loss) while avoiding separate reflective component assemblies, thus not significantly increasing device complexity
Solution Approach 2:
By optimizing the metallization layer thickness to 50-200nm and selecting appropriate materials (Al, Ag, Au), the patent achieves high light reflectivity with a thin layer that adds minimal structural complexity. The parameter optimization ensures effective light utilization without requiring thick or multi-layered reflective structures
3Reliability
If multiple protection layers and antioxidation layers are added to protect the metallic reflective layer, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies protective layers (SiO2, Si3N4, or organic protective layers) and antioxidation layers to the metallization layer before final assembly. This preliminary protection prevents oxidation and damage during manufacturing and operation, improving reliability while using standard thin-film deposition processes that maintain reasonable manufacturing precision
Solution Approach 2:
The patent specifies thickness ranges for protective layers (50-500nm) and antioxidation layers (10-100nm), providing clear parameter control targets that balance protection effectiveness with manufacturing feasibility. These parameter specifications enable reliable protection without requiring extreme manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces power consumption and extends the service life of Mini LED backlight modules by improving light utilization and enabling higher-quality backlight sources with lower energy usage.
Implementation Method 1
a metallic reflective layer, located at a side of the second protection layer facing away from the base substrate and configured to reflect light irradiated onto the metallic reflective layer from the micro LED
Data Source
AI summary
A backplane, a manufacturing method thereof, a backlight module and a display panel are provided. The backplane includes a base substrate; a first conductive layer located on the base substrate and including a wire; a first protection layer located at a side of the first conductive layer facing away from the base substrate; a second conductive layer located on the first protection layer and including a conductive sub-layer, the conductive sub-layer penetrating the first protection layer to be connected with the wire; a second protection layer located at a side of the second conductive layer facing away from the base substrate; a micro light-emitting diode (LED) penetrating the second protection layer to be connected with the conductive sub-layer; and a metallic reflective layer, located on the second protection layer and configured to reflect light irradiated onto the metallic reflective layer from the micro LED.