Mini LED Wiring Plate Layout for Backup Chip Connections
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Solution Overview
Problem
Current display technologies face challenges in achieving high brightness and contrast, particularly when using Mini LED as a backlight source, as they often result in inefficient power consumption and limited backup options for defective light emitting diode chips.
Innovation Solution
A light emitting plate and wiring plate design featuring a base substrate with arranged light emitting units and connection line units, each with multiple electrical contact pairs, allowing for dual-side driving and backup connections to reduce power consumption and enable repair of defective light emitting diode chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If Mini LED is used as a backlight source with traditional liquid crystal display panel, then high contrast is achieved, but power consumption efficiency deteriorates
Solution Approach 1:
The backlight system is segmented into multiple independently controllable Mini LED zones along the first and second directions. Each zone can be individually controlled to achieve local dimming, improving contrast while reducing overall power consumption by activating only necessary regions.
Solution Approach 2:
The patent implements dynamic control of Mini LED backlight zones through connection line units that can selectively activate different LED chips based on display content requirements. This dynamic adjustment optimizes power consumption efficiency while maintaining high contrast performance.
2Illumination intensity
If Mini LED is used as a backlight source, then high contrast is achieved, but backup options for defective light emitting diode chips are limited
Solution Approach 1:
The patent incorporates backup connection line units and redundant electrical contact pairs in advance during manufacturing. When a Mini LED chip becomes defective, the system can pre-switch to backup connection paths without requiring external repair intervention, enhancing reliability.
Solution Approach 2:
The design allows defective Mini LED chips to be electrically isolated and discarded from the active circuit through the multi-path connection structure. The system recovers functionality by redirecting current through alternative connection line units, maintaining display operation despite chip failures.
3Productivity
If multiple electrical contact pairs are arranged in each connection line unit, then bonding yield is enhanced, but device complexity increases
Solution Approach 1:
Multiple electrical contact pairs are merged into integrated connection line units that combine multiple functions (power supply, signal transmission, and backup paths) into single structural elements. This merging approach enhances bonding yield while minimizing the increase in overall device complexity.
Solution Approach 2:
The connection line units are designed with multi-functionality, serving as both primary electrical connections and backup pathways simultaneously. Each connection line unit can perform multiple roles depending on the operational status of Mini LED chips, reducing the need for separate dedicated backup structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the bonding yield of products, reduces power consumption by distributing current efficiently, and provides backup options for defective light emitting diode chips, improving the overall performance and reliability of display devices.
Implementation Method 1
each of the plurality of light emitting units comprising at least one light emitting sub-unit, the light emitting sub-unit comprising a connection line unit and a light emitting diode chip connected with the connection line unit
Data Source
AI summary
A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes light emitting units. Each light emitting unit includes a light emitting sub-unit including a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes electrical contact pairs, and each electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one electrical contact pairs in each connection line unit is connected with the light emitting diode chip; in each connection line unit, at least two first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts.