Mini LED Display Module Electrode Layout for Wider Bonding Area
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Solution Overview
Problem
Existing technologies face limitations in securing a sufficient bonding area and process margin for connecting miniaturized LEDs to circuit boards, leading to potential short circuits and reduced mass production capability.
Innovation Solution
A display module design that includes a circuit board with individual and common electrodes of opposite polarity, connected via a top connection layer and connecting elements, allowing for a wider bonding area and improved connectivity between LEDs and the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip bonding method is used to connect LEDs to circuit board, then electrical connection is achieved, but bonding area is limited and risk of short circuit increases
Solution Approach 1:
The patent transitions from conventional planar flip bonding to a vertical stacking architecture where LEDs are mounted upright on the circuit board. This dimensional change allows the bonding interface to extend vertically rather than being constrained to a horizontal plane, effectively increasing the bonding area and improving electrical connection reliability without expanding the horizontal footprint.
Solution Approach 2:
The patent divides the bonding connection into multiple segments: individual electrodes for anode connection, common electrodes for cathode connection, and separate connection layers for different polarity connections. This segmentation distributes the bonding load across multiple discrete connection points, increasing total bonding area and reducing the risk of short circuits between adjacent electrodes.
2Manufacturing precision
If miniaturization of LEDs is pursued for high resolution, then image quality improves, but bonding area and process margin are reduced
Solution Approach 1:
By mounting LEDs vertically rather than horizontally, the patent enables the bonding area to extend in the vertical dimension. This allows miniaturized LEDs to maintain adequate bonding area for reliable connection while preserving their small horizontal footprint, thus achieving both high resolution and sufficient bonding area.
Solution Approach 2:
The patent changes the mounting orientation parameter from horizontal (flip-chip) to vertical (upright), which fundamentally alters the bonding geometry. This parameter change allows the bonding area to scale differently with LED size, maintaining process margins even as LED dimensions are reduced for high resolution displays.
3Reliability
If two electrodes are connected to circuit board electrodes, then electrical connection is achieved, but process margin is limited and mass production capability is reduced
Solution Approach 1:
The patent segments the electrical connection into separate individual electrode connections and common electrode connections, with dedicated connection layers for each. This segmentation simplifies the manufacturing process by allowing standardized connection procedures to be applied repeatedly, thereby improving mass production capability while maintaining reliable electrical connections.
Solution Approach 2:
The patent designs the connection structure with universal features that can be applied across all LED positions on the circuit board. The standardized individual and common electrode patterns, along with uniform connection layer structures, enable scalable manufacturing processes that maintain consistent quality across large production volumes.
Data Source
AI summary
A display module and an electronic device are provided. The display module includes a circuit board including a plurality of individual electrodes and a plurality of common electrodes having a polarity opposite to a polarity of the plurality of individual electrodes; a plurality of light emitting diodes (LEDs), each LED of the plurality of LEDs including a plurality of semiconductor layers, a first pixel electrode connected to the plurality of individual electrodes, and a second pixel electrode at an opposite direction from the first pixel electrode, respectively; a top connection layer on the plurality of LEDs and connected to the second pixel electrode; and a plurality of connecting elements connecting the top connection layer to the plurality of common electrodes.