Mini LED Chip Bridging Structure to Prevent Film Cracking
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Solution Overview
Problem
The existing Mini LED technology faces challenges in improving the performance and integrity of the semiconductor layers in light emitting diode chips, particularly in maintaining the integrity of the bridging film layer during the manufacturing process, which can lead to cracks and reduced efficiency.
Innovation Solution
The design includes a light emitting diode chip with a base substrate featuring adjacent light emitting units connected by a bridging part with an inclined connecting part and an insulation layer, where the inclination of the inclined part is controlled within 60° to ensure the integrity of the bridging film layer, and multiple bridging parts are used to connect semiconductor layers, reducing the likelihood of cracks and enhancing electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bridging part is disposed on the side wall of the light emitting unit, then the electrical connection between adjacent light emitting units is improved, but the bridging film layer may crack during manufacturing process
Solution Approach 1:
The bridging part is designed with an inclined surface that slopes downward from the side wall toward the groove, creating a curved transition rather than a sharp angle. This curved structure distributes stress more evenly during manufacturing processes like wire bonding, preventing crack formation in the bridging film layer while maintaining electrical connectivity between adjacent light emitting units.
2Reliability
If the inclination angle of the bridging part is increased to improve electrical connection, then the connectivity between light emitting units is enhanced, but the risk of bridging film layer cracking increases
Solution Approach 1:
The patent specifies that the inclination angle of the bridging part should be within 0° to 45° relative to the horizontal plane. This parameter optimization balances electrical connectivity (requiring sufficient slope) with manufacturing reliability (avoiding excessive angles that cause film cracking). The controlled angle range ensures both functional and structural requirements are met.
3Reliability
If multiple bridging parts are used to connect semiconductor layers, then the electrical connectivity is improved and crack risk is reduced, but the device complexity increases
Solution Approach 1:
The connection between adjacent light emitting units is divided into multiple segments: the inclined bridging part on the side wall, the groove structure, and additional bridging parts on the top surface. This segmentation distributes the electrical connection path across multiple controlled elements, improving overall reliability by providing redundant pathways and reducing the impact of any single point of failure, while keeping each individual component relatively simple.
Data Source
AI summary
Provided is a light emitting diode chip, including: a base substrate; at least two light emitting units disposed on the base substrate, wherein the at least two light emitting units include adjacent first light emitting unit and second light emitting unit, and each of the first light emitting unit and the second light emitting unit includes: a first semiconductor layer disposed on the base substrate; a light emitting layer disposed on the first semiconductor layer away from the base substrate; and a second semiconductor layer disposed on the light emitting layer away from the base substrate, wherein the light emitting diode chip further includes a bridging part for conducting, and the bridging part is configured to electrically connect the second semiconductor layer of the first light emitting unit with the first semiconductor layer of the second light emitting unit.