Mini LED Chip Array Transfer for EL Testing and Pitch Control
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Solution Overview
Problem
Current manufacturing processes for Mini LED/Micro LED display devices face challenges in mass transfer and electroluminescent (EL) testing, which affect the efficiency and accuracy of the production process.
Innovation Solution
The integration of a plurality of miniature light emitting diodes with a Mini IC, along with a method for manufacturing a display substrate that involves transferring miniature light emitting diodes to a substrate and then to a base substrate, facilitates mass transfer and EL testing, thereby simplifying the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional mass transfer processes are used for Mini LED/Micro LED, then transfer capability is limited, but production efficiency and accuracy deteriorate
Solution Approach 1:
The patent divides the transfer process into two distinct stages: first transferring multiple miniature light emitting diodes to an intermediate substrate, then transferring the entire assembly to the final substrate. This segmentation allows each transfer operation to be optimized independently, improving both productivity and precision.
Solution Approach 2:
The patent introduces an intermediate substrate as a mediator in the transfer process. This intermediate substrate serves as a temporary platform that facilitates the mass transfer of miniature light emitting diodes, enabling efficient handling and precise positioning during the manufacturing process.
2Productivity
If traditional EL testing methods are used, then testing efficiency is low, but detection accuracy deteriorates
Solution Approach 1:
The patent combines multiple miniature light emitting diodes with a Mini IC on the same substrate, allowing EL testing to be performed on the integrated structure. This merging enables simultaneous testing of multiple devices, significantly improving testing efficiency while maintaining detection accuracy through the unified test interface.
3Manufacturing precision
If pitch control is not optimized, then manufacturing is simpler, but display quality deteriorates
Solution Approach 1:
The patent performs preliminary arrangement of miniature light emitting diodes on the intermediate substrate before final transfer, allowing pitch to be controlled and adjusted in advance. This preliminary action enables precise pitch control to be achieved more easily during the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the difficulty of massive transfer, enables efficient EL detection, and allows for better control over the pitch between miniature light emitting diode chips, ultimately improving the production efficiency and quality of Mini LED/Micro LED display devices.
Implementation Method 1
a light conversion layer arranged on the first side of the substrate, and the light conversion layer is configured to convert light in a first wavelength range into light in a second wavelength range
Data Source
AI summary
A miniature light emitting diode chip, a display substrate and a manufacturing method thereof, and a display device are provided. The miniature light emitting diode chip includes: a substrate, including a first side and a second side; a first contact portion and a plurality of contact portions; and a plurality of miniature light emitting diodes. The miniature light emitting diodes each include a first electrode and a second electrode. An orthographic projection of a combination of the plurality of miniature light emitting diodes and a spacing between any two of the plurality of miniature light emitting diodes falls within the substrate. The first electrode of each of the plurality of miniature light emitting diodes is electrically connected to the first contact portion, and the second electrode of each of the plurality of miniature light emitting diodes is electrically connected to the plurality of second contact portions, respectively.