Miniaturized Optical Sensor Package With Integrated Stray Light Blocking
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Solution Overview
Problem
Conventional optical sensor packages are too large for integration into movable or wearable electronic devices due to the separate arrangement of the light source and light blocking cover on a printed circuit board, which increases the package size.
Innovation Solution
A miniaturized optical sensor package design where a light source and a light blocking wall are directly formed on the base layer of the optical sensor chip, with a second light blocking wall made of a different material, reducing the overall package size by integrating the light blocking structure onto the chip itself.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the light source and light blocking cover are arranged separately on a printed circuit board, then the light blocking function is achieved, but the package size becomes large
Solution Approach 1:
The patent merges the light blocking wall directly onto the base layer of the optical sensor chip, integrating two previously separate components (light source and light blocking structure) into a single integrated package. This eliminates the need for a separate printed circuit board arrangement and reduces the overall package size while maintaining the light blocking function.
Solution Approach 2:
The light blocking wall is formed by stacking multiple layers with different materials in the vertical dimension, creating a three-dimensional light blocking structure. This multi-layer approach allows effective light blocking while minimizing the horizontal footprint on the chip, thus reducing package size without compromising blocking effectiveness.
2Object-affected harmful factors
If a light blocking wall is formed with multiple material layers, then light blocking effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs multiple material layers with different optical properties (transparency, refractive index, absorption characteristics) to block stray light effectively. By changing material parameters vertically through stacked layers, the design achieves superior light blocking performance while using standard semiconductor manufacturing techniques for deposition and patterning.
Solution Approach 2:
The light blocking wall is constructed as a composite structure with multiple material layers, each selected for specific optical properties. This composite approach allows the structure to block different wavelengths and angles of stray light effectively, while the layers can be deposited using conventional semiconductor fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the size of the optical sensor package while eliminating stray light interference, making it suitable for smaller electronic devices by integrating the light source and light blocking walls on the optical sensor chip.
Implementation Method 1
a light blocking wall arranged on the base layer and between the light detection region and the light source
Data Source
AI summary
There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.