Minute Pattern Mask Formation via Resin Reflow and Etching
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Solution Overview
Problem
Current methods for forming fine and minute patterns in electronic devices, such as photolithography, are limited by the resolution of light exposure tools and are not cost-effective for producing high precision patterns.
Innovation Solution
A method involving the formation of a convex pattern on a substrate, followed by coating a resin composition and ashing or etching to create a minute pattern mask, which is then used to etch the target layer, utilizing heat reflow and selective etching to achieve precise pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography process is used with conventional light exposer, then exposure can be performed with existing equipment, but the beam size is limited and patterns smaller than 3 μm cannot be formed
Solution Approach 1:
The patent segments the pattern formation process into multiple steps: first forming a convex pattern, then coating resin composition in the concave portions, and finally etching to create the minute pattern mask. This segmentation allows achieving sub-3 μm precision without requiring advanced light exposer equipment, as each step uses conventional processes that collectively produce the fine pattern.
Solution Approach 2:
The patent performs preliminary actions by first forming the convex pattern and coating the resin composition before the final etching step. The resin composition is pre-positioned in the concave portions between convex parts, and after etching the convex parts, the resin remains as the minute pattern mask. This preliminary positioning enables precise pattern formation using conventional equipment.
2Manufacturing precision
If conventional photolithography is used, then existing equipment can be utilized, but the resolution is insufficient for forming patterns with widths less than 3 μm
Solution Approach 1:
The patent introduces resin composition as an intermediary material that is coated in the concave portions between convex parts. This resin acts as a mediator that defines the final minute pattern shape after the convex parts are etched away. The intermediary resin layer enables high-resolution patterning (less than 3 μm) using conventional etching equipment, as the resin self-aligns and defines the pattern boundaries.
Solution Approach 2:
The patent changes the physical and chemical parameters of the resin composition, including its viscosity, curing characteristics, and etch resistance. By optimizing these parameters, the resin can be precisely deposited in narrow concave portions and maintain its shape during subsequent processing, enabling sub-3 μm resolution with conventional manufacturing equipment and processes.
3Manufacturing precision
If additional equipment is acquired to form smaller patterns, then pattern precision can be improved, but manufacturing cost increases
Solution Approach 1:
The patent makes existing conventional equipment perform multiple functions: the convex pattern formation uses standard photolithography, the resin coating uses conventional coating equipment, and the etching uses standard etching equipment. Each piece of existing equipment is used for its primary function, but the combination achieves the multi-functional result of forming sub-3 μm patterns without requiring specialized high-resolution equipment, thereby avoiding additional capital costs.
Solution Approach 2:
The patent creates a physical copy or replica of the desired minute pattern using the resin composition, which is deposited in the concave portions between convex parts. This resin copy serves as the minute pattern mask that defines the final pattern. By copying the pattern geometry through resin deposition rather than direct light exposure, the method achieves high precision using conventional low-cost equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the cost-effective and precise formation of minute patterns and masks, enabling the creation of patterns beyond the resolution limits of traditional light exposure tools, with improved uniformity and accuracy.
Implementation Method 1
heating the plurality of first resin patterns for reflowing
Implementation Method 2
Ashing or etching is performed on the resin layer to form a plurality of first resin patterns
Implementation Method 3
The plurality of first resin patterns is processed to form a minute pattern mask
Data Source
AI summary
A method for forming a minute pattern mask includes forming an etching target layer on a substrate. A convex pattern including a plurality of convex parts is formed on the etching target layer. A resin composition is coated on the convex pattern to form a resin layer including a first region neighboring the convex part and a second region positioned between the neighboring convex parts. The resin layer is ashed or etched to form the plurality of first resin patterns. The plurality of first resin patterns is processed to form a minute pattern mask including a plurality of second resin patterns. The etching target layer is etched using the plurality of second resin patterns as an etch mask to form a minute pattern.