Mirror-Coating Optical Components with Sacrificial Layer

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Solution Overview

Problem

Existing methods for mirror-coating outside surfaces of optical components in optoelectronic semiconductor bodies are inefficient, leading to structural compactness issues and potential degradation of organic layers, with radiation leakage into potting materials and undefined radiation characteristics.

Innovation Solution

A method involving a sacrificial layer applied to optical components, followed by a metallic mirror layer deposition using sputtering or vapor deposition, and subsequent removal of the sacrificial layer, ensuring complete mirror-coating without potting material interference, with the mirror layer providing thermal stability and radiation protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If existing mirror-coating methods are used, then the coating process is simpler, but the structural compactness deteriorates and organic layers degrade

Engineering Contradiction:
Improvecoating process simplicityVSAvoidorganic layer integrity
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

A sacrificial layer is applied to the front side of the optical component before the mirror coating process. This preliminary action protects the organic layers on the front side from degradation during mirror coating, while enabling complete mirror coating of all other surfaces including side surfaces that would otherwise be inaccessible.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The sacrificial layer acts as an intermediary substance between the mirror coating material and the optical component's front side. It allows the mirror coating to be applied uniformly across all surfaces without directly contacting and degrading the organic layers, thus mediating the interaction between the coating process and the sensitive components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If existing mirror-coating methods are used, then the process requires fewer steps, but radiation leakage into potting materials occurs

Engineering Contradiction:
Improvecoating process efficiencyVSAvoidradiation leakage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The sacrificial layer is applied in advance to define the precise boundary of the front side. This preliminary structuring enables the mirror coating to extend exactly to the component edges without over-coating into the potting material, preventing radiation leakage while maintaining coating efficiency.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The mirror coating is applied with different coverage characteristics on different surfaces: complete coverage on side surfaces and rear side, but controlled termination at the front side boundary defined by the sacrificial layer. This local differentiation ensures radiation containment without compromising overall coating efficiency.

Inventive Principle:
Principle #3Local quality

3Productivity

If existing mirror-coating methods are used, then the coating application is faster, but the mirror coating coverage is incomplete

Engineering Contradiction:
Improvecoating application speedVSAvoidmirror coating coverage
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The sacrificial layer extends not only on the front surface but also forms side surfaces that define the lateral boundaries. This three-dimensional structure enables the mirror coating to be applied in one continuous process to all surfaces including vertical side surfaces, achieving complete coverage without requiring multiple coating steps.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The sacrificial layer is prepared in advance to create a defined geometry that guides the mirror coating application. This preliminary structuring ensures that the mirror coating material is deposited uniformly and completely on all intended surfaces while maintaining precise boundary definition, achieving both speed and precision.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces compact, thermally stable, and self-supporting mirror-coated optical components with defined radiation characteristics, preventing radiation leakage into potting materials and maintaining organic layer integrity.

Implementation Method 1

a mirror layer is applied on to the components, so that the mirror layer partly or completely covers the sacrificial layer and all other sides of each component that are not covered by the carrier

Methodology Applied
Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

The mirror layer can, e.g., be applied by means of a sputtering process or a vapor deposition process

Methodology Applied
Scientific EffectSputtering: Sputtering

Implementation Method 3

The mirror layer can, e.g., be applied by means of a sputtering process or a vapor deposition process

Methodology Applied
Scientific EffectVapor deposition: Physical Vapour Deposition

Implementation Method 4

the mirror layer providing thermal stability and radiation protection

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS10290782B2Method for mirror-coating lateral surfaces of optical components for use in optoelectronic semiconductor bodies, and optoelectronic semiconductor body which can be mounted on surfaces
Publication Date: 2019.05.14 OSRAM OLED
  • US10290782B2 patent drawing
  • US10290782B2 patent drawing
  • US10290782B2 patent drawing

AI summary

A method for mirror-coating lateral surfaces of optical components, a mirror-coated optical component and an optoelectronic semiconductor body mountable on surface are disclosed. In an embodiment, an optoelectronic semiconductor body includes a semiconductor chip having a radiation side and a contact side different from the radiation side, wherein contact elements for electrically contacting the semiconductor body are attached to the contact side, and wherein the contact elements are freely accessible. The body further includes a metal mirror layer disposed on the semiconductor chip, wherein the metal mirror layer has a reflectivity of at least 80% to radiation emitted by the semiconductor chip during operation, wherein the mirror layer is a continuous and contiguous mirror layer, which covers all sides of the semiconductor chip that are not the contact side and the radiation side by at least 95%, and wherein the mirror layer is arranged at the semiconductor chip in a form-fit manner.