Multi-Mode Fluid Cooling System Using Mixed Boiling Point Coolants
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Solution Overview
Problem
Current spray cooling systems for electronic circuitry face limitations such as low critical heat flux, non-uniform heat transfer, and orientation constraints due to inefficient coolant drainage, which can lead to surface dryout and catastrophic failure.
Innovation Solution
A multi-mode fluid cooling system using a mixture of cooling fluids with different boiling points is employed, where the more volatile component evaporates to enhance heat removal while the less volatile component remains liquid, maintaining surface wetness and reducing temperature variations, thereby improving cooling efficiency and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If spray cooling systems use single-phase liquid cooling, then heat transfer efficiency is limited, but system complexity and cost increase when using two-phase evaporative cooling
Solution Approach 1:
The patent changes the physical parameter of the cooling fluid by using a mixture of liquids with different boiling points instead of a single liquid. This allows the system to utilize both single-phase and two-phase cooling mechanisms simultaneously, achieving higher heat removal rates without requiring complex external refrigeration systems.
Solution Approach 2:
The patent employs a composite cooling fluid consisting of multiple liquid components with different volatilities. The more volatile component evaporates to provide high heat removal through phase change, while the less volatile component remains liquid to maintain surface wetness and provide continuous heat conduction, creating a synergistic cooling effect.
2Temperature
If conventional liquid cooling systems use cold plates bonded to chip packages, then thermal resistance at the interface creates large temperature differences, but direct spray cooling reduces thermal resistance
Solution Approach 1:
The patent removes the cold plate intermediary component between the heat-generating surface and the cooling fluid. By spraying cooling fluid directly onto the heated surface, the system eliminates the thermal resistance associated with cold plate bonding interfaces, achieving more efficient heat transfer.
3Reliability
If spray cooling systems increase fluid flow rate to prevent surface dryout, then cooling capacity improves, but pump size and power consumption increase
Solution Approach 1:
The patent changes the composition parameter of the cooling fluid by incorporating a mixture of liquids with different boiling points. The less volatile component provides extended liquid-phase cooling and maintains surface wetness more effectively, allowing reduced fluid flow rates while preventing dryout, thereby reducing pump power requirements.
4Reliability
If spray cooling systems use high flow rates to maintain surface wetness, then dryout is prevented, but system size and cost increase due to larger pumps and heat exchangers
Solution Approach 1:
The patent modifies the physical composition of the cooling fluid by using a mixture of liquids with different volatilities. This allows the system to maintain surface wetness at lower flow rates because the less volatile component evaporates more slowly and provides sustained liquid-phase cooling, reducing the required size of pumps and heat exchangers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves higher heat removal rates with less fluid flow, reducing the risk of surface dryout and allowing for smaller pumps and heat exchangers, while maintaining uniform surface temperatures and increasing critical heat flux.
Implementation Method 1
the more volatile component evaporates to enhance heat removal
Implementation Method 2
heat is then transported from the surface by heating the flowing liquid
Data Source
AI summary
A cooling system and method that significantly improves spray evaporative cooling by using a mixture of cooling fluids having different boiling points. The cooling fluid mixture is sprayed onto a surface to be cooled. Efficient cooling with reduced cooling fluid volume is provided by both evaporation of the more volatile component of the mixture as well as heating of the less volatile component which remains in contact with the surface being cooled. More uniform temperatures across the surface being cooled and a reduced risk of potentially damaging critical heat flux is achieved.