Mixed-Light Micro LED Stacking for Higher Brightness Density
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Solution Overview
Problem
Conventional LED light sources have limited luminous brightness per unit area due to the two-dimensional arrangement of LED chips, which occupies significant space and restricts achievable luminous intensity.
Innovation Solution
The mixed light LED device incorporates three lateral micro LED chips with a unique electrode unit configuration, where a first-type electrode connects all chips, and second-type electrodes connect the second and third chips to the first chip's semiconductor layer, allowing for vertical arrangement and reducing the occupied area while increasing luminous intensity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chips are arranged in horizontal rows (conventional two-dimensional arrangement), then the structure is simple and easy to manufacture, but the luminous brightness per unit area is limited
Solution Approach 1:
The patent transitions from a conventional two-dimensional horizontal arrangement of LED chips to a three-dimensional vertical stacking configuration. Multiple LED chips are arranged in layers along the vertical direction, with each layer containing LED chips that emit different wavelengths. This dimensional change allows the system to achieve higher luminous brightness per unit area by utilizing the vertical space, thereby resolving the contradiction between increasing illumination intensity and reducing occupied area.
2Illumination intensity
If multiple LED chips are arranged vertically to increase luminous intensity, then the luminous brightness per unit area increases, but the electrode connection structure becomes more complex
Solution Approach 1:
The patent merges the electrode connection functions by designing a unified electrode structure that simultaneously connects multiple LED chips in the vertical stack. The electrode unit integrates both the first-type electrode (connecting first-type semiconductor layers) and the second-type electrode (connecting second-type semiconductor layers) into a single coordinated system, simplifying the overall connection architecture while maintaining the vertical arrangement for high luminous intensity.
Solution Approach 2:
The electrode unit is designed with multi-functionality to handle connections for both first-type and second-type semiconductor layers across multiple vertical layers. This universal electrode structure performs multiple connection functions simultaneously, reducing the need for separate complex wiring for each LED chip and layer, thereby managing device complexity while achieving high luminous brightness per unit area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances luminous intensity per unit area and reduces the two-dimensional space occupied by LED chips, improving the brightness of the LED device.
Implementation Method 1
a first chip P-N junction layer stacked with the first chip first-type semiconductor layer and the first chip second-type semiconductor layer
Data Source
AI summary
A mixed light light-emitting diode device includes first, second, and third chips, each having a first-type semiconductor layer with a first surface, a second-type semiconductor layer with a second surface opposite to the first surface, and a third surface indenting from the first surface and situated on the second-type semiconductor layer. The second and third chips have their first surfaces disposed above and facing the first surface of the first chip. A first-type electrode penetrates through the second and first surfaces of the first chip and contacts all first surfaces of first, second, and third chips. Two second-type electrodes each penetrates through the second and third surfaces of the first chip and connect the first chip to one of the second and third chips.