Mixed Pitch Wiring Substrate for Heterogeneous Integration
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Solution Overview
Problem
Heterogeneous integration technologies face challenges in efficiently integrating components with different wiring densities and manufacturing processes into a single chip, leading to complexity and increased costs due to height differences and manufacturing limitations.
Innovation Solution
A substrate with mixed pitch wiring density, incorporating an interposer with a different wiring density that provides a bridge connection between die, utilizing solder bumps for electrical connection, and a planarization process to reduce height differences and simplify assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heterogeneous integration technologies are used to assemble multiple separately manufactured components into a single chip, then functionality and operating characteristics are improved, but device complexity and manufacturing costs increase due to height differences and manufacturing limitations
Solution Approach 1:
The substrate is divided into multiple regions with different pitch wiring densities, allowing each region to be optimized for specific functions. This segmentation enables heterogeneous integration of components with different manufacturing processes while maintaining overall system functionality and reducing manufacturing complexity.
Solution Approach 2:
Different regions of the substrate are assigned different wiring densities based on local functional requirements. High-pitch regions accommodate components with larger spacing requirements, while low-pitch regions support densely packed components, thereby optimizing functionality without uniformly increasing device complexity across the entire substrate.
2Adaptability or versatility
If components with different wiring densities and manufacturing processes are integrated into a single chip, then functionality is improved, but manufacturing precision and cost increase due to height differences
Solution Approach 1:
The substrate incorporates multiple wiring layers at different heights to accommodate components with different wiring densities. By utilizing the vertical dimension, the patent enables integration of heterogeneous components without compromising manufacturing precision, as each layer can be optimized for its specific pitch requirements while maintaining overall alignment and connection accuracy.
3Adaptability or versatility
If separate components are manufactured and then assembled into a single chip, then adaptability is improved, but productivity decreases due to increased assembly complexity
Solution Approach 1:
Multiple separately manufactured components are integrated onto a single substrate with mixed pitch wiring regions, combining them into one unified assembly. This merging approach maintains the flexibility of separate component manufacturing while improving productivity by reducing the number of discrete assembly steps and enabling more efficient packaging and testing processes.
Data Source
AI summary
In some examples, an electronic package and methods for forming the electronic package are described. The electronic package can be formed by disposing an interposer on a surface of a substrate having a first pitch wiring density. The interposer can have a second pitch wiring density different from the first pitch wiring density. A layer of non-conductive film can be situated between the interposer and the surface of the substrate. A planarization process can be performed on a surface of the substrate. A solder resist patterning can be performed on the planarized surface the substrate. A solder reflow and coining process can be performed to form a layer of solder bumps on top of the planarized surface of the substrate. The interposer can provide bridge connection between at least two die disposed above the substrate. Solder bumps under the interposer electrically connect the substrate and the interposer.