MLCC Conductive Resin Layer Using Ag-Coated Cu for Ion Migration Control
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) face issues with ion migration and oxidation of conductive resin layers due to excessive Ag content or partial condensation of Ag particles, and CO2 outgassing due to high Cu content, especially in high-temperature and high-pressure environments, which affects their reliability and performance.
Innovation Solution
A multilayer electronic component design incorporating a conductive resin layer with Cu particles and Ag-coated Cu particles, where Ag is only present on the surface of the second conductive particles, avoiding excessive Ag content and ensuring the resin layer does not contain Ag except on the particle surfaces, thereby suppressing ion migration and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If Ag content is increased in the conductive resin layer to suppress oxidation, then oxidation resistance is improved, but ion migration occurs due to excessive Ag or partial condensation of Ag particles
Solution Approach 1:
The patent applies local quality by creating a dual-structure conductive resin layer: an Ag-containing layer close to the internal electrode for local oxidation suppression, and an Ag-free Cu particle layer on the outer surface to prevent ion migration. This spatial differentiation of Ag content allows each region to fulfill its specific function without the adverse effects of excessive Ag throughout the entire layer.
Solution Approach 2:
The conductive resin layer is segmented into multiple regions with different compositions: an inner region containing Ag particles for oxidation resistance near the electrode, and an outer region with Cu particles only to prevent ion migration. This segmentation resolves the contradiction by separating the opposing requirements into distinct spatial zones within the same functional layer.
2Reliability
If Cu content is increased in the conductive resin layer to improve conductivity, then electrical conductivity is improved, but CO2 outgassing occurs due to oxidation of Cu and denaturalization of epoxy resins in high temperature and high pressure environment
Solution Approach 1:
The patent applies preliminary anti-action by introducing a low-melting-point metal that reacts with Cu particles before they can oxidize and cause CO2 outgassing. This metal forms a protective layer or alloy structure that prevents the oxidation reactions, thereby maintaining high Cu content for conductivity while eliminating the harmful outgassing effect in advance.
Solution Approach 2:
A low-melting-point metal acts as an intermediary substance between Cu particles and the oxidizing environment. This intermediary prevents direct contact between Cu and oxygen, blocking the oxidation pathway that leads to CO2 outgassing, while still allowing the Cu particles to maintain their conductive function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the multilayer electronic component by reducing ion migration, oxidation, and CO2 outgassing, while maintaining excellent electrical conductivity and mechanical strength, even under extreme environmental conditions.
Implementation Method 1
when the conductive metal particles are Ag, there is an advantage in that oxidation is suppressed
Implementation Method 2
When the conductive metal particles are Ag, there is an advantage in that oxidation is suppressed. However, when an Ag content is high or Ag particles are partially condensed and present in the conductive resin layer, ion migration may occur
Implementation Method 3
CO2 (outgassing) may occur due to oxidation of Cu and denaturalization of epoxy resins in a high temperature and high pressure operating environment of multilayer electronic components
Data Source
AI summary
A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.