Ceramic Wire-Reinforced MLCC Structure for Crack Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face challenges in withstanding high voltage and external impacts due to electrostrictive effects, leading to potential cracks and reduced mechanical strength, and existing design changes to mitigate these issues often result in insufficient capacitance and reliability.
Innovation Solution
Incorporating ceramic wires in the cover and margin portions of the multilayer electronic component, arranged in specific directions to enhance mechanical properties and prevent cracks, while maintaining or increasing capacitance formation area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the dielectric layer is reduced to achieve miniaturization, then the size of the component is reduced, but the capacitance and mechanical strength are insufficient
Solution Approach 1:
The patent incorporates ceramic wires (such as alumina, silica, or zirconia wires) into the dielectric layer to create a composite structure. This composite material approach allows the dielectric layer to maintain reduced thickness for miniaturization while the ceramic wires provide reinforcement that prevents cracks and maintains mechanical strength, thus resolving the contradiction between size reduction and reliability maintenance
2Volume of moving object
If the thickness of the cover and margin portions is reduced to achieve miniaturization, then the component size is reduced, but the capacitance forming area is insufficient
Solution Approach 1:
By incorporating ceramic wires into the cover and margin portions, the patent enables these regions to provide mechanical reinforcement without increasing overall component size. The ceramic wire-reinforced composite structure allows the capacitance forming area to be maximized within the reduced component volume, as the reinforcement comes from the embedded wires rather than increased thickness
3Reliability
If design changes are made to prevent cracks from electrostrictive effects, then reliability is improved, but unexpected side effects occur
Solution Approach 1:
The patent changes the material composition parameter of the dielectric layer by incorporating ceramic wires with specific properties (alumina, silica, or zirconia with 5-20 micrometer diameter). This parameter change provides crack resistance against electrostrictive effects while maintaining design flexibility, as the ceramic wire reinforcement mechanism is more adaptable than traditional design changes to cover and margin thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved mechanical strength and reliability by suppressing cracks and delamination, maintaining capacitance, and enhancing resistance to electrostrictive effects and external impacts, thus addressing the limitations of existing designs.
Implementation Method 1
multilayer electronic components having excellent reliability even in high heat or external impacts are required. In detail, as technology develops, high voltage products are required. To manufacture such products, it is essential to develop high withstand voltage characteristics. Therefore, it is necessary to have excellent mechanical properties to withstand chip expansion and contraction due to the electrostriction effect (inverse piezoelectric effect)
Data Source
AI summary
A multilayer electronic component includes a body having a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween, and an external electrode disposed on the body in a second direction perpendicular to the first direction and connected to the internal electrodes. The body includes an active portion including the internal electrodes to form capacitance and cover portions disposed on both end surfaces of the active portion in the first direction, and the cover portion includes a ceramic wire. The ceramic wire includes at least one or more groups arranged in one direction.