Multilayer Ceramic Capacitor Crack Prevention via Dielectric Particle Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors with smaller heights are prone to cracking due to lack of strength, and existing methods to compensate for this, such as using dielectric layers between wrap-around parts, are ineffective as they often result in gaps or obstructions during mounting on a circuit board.
Innovation Solution
A multilayer ceramic capacitor design featuring first base conductor films and a supplementary dielectric layer connected through mutual bonding of dielectric particles, with surface conductor films forming wrap-around parts that securely attach to the capacitor body, ensuring strong connections and preventing gaps under external forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If dielectric layers are provided between two wrap-around parts to compensate for lack of strength, then the strength of the capacitor body is improved, but gaps form between the dielectric layers and wrap-around parts making the strength compensation ineffective
Solution Approach 1:
The patent applies preliminary action by forming protrusions on the dielectric layers before mounting, which then engage with recesses in the wrap-around parts. This pre-formed mechanical interlocking structure ensures that when the capacitor body experiences warping forces during or after mounting, the dielectric layers remain securely positioned and maintain continuous contact with the wrap-around parts, preventing gap formation and ensuring effective strength compensation from the outset
Solution Approach 2:
The patent introduces a vertical dimension to the connection between dielectric layers and wrap-around parts by forming protrusions that extend upward from the dielectric layers. This three-dimensional mechanical interlocking structure transforms a potentially two-dimensional contact interface into a robust multi-point connection, ensuring reliable strength compensation even when the capacitor body is subjected to warping forces
2Reliability
If dielectric layers are made thicker to eliminate gaps, then gap elimination is achieved, but the dielectric layers become obstructions during mounting on circuit board
Solution Approach 1:
The patent applies segmentation by dividing the dielectric layer into multiple segments with recesses between them. This segmentation allows the wrap-around parts to penetrate through the dielectric layers and engage with the capacitive element, eliminating gaps while maintaining a compact overall height that does not obstruct mounting operations on the circuit board
3Volume of moving object
If capacitor body height is reduced, then the capacitor becomes more compact, but the likelihood of cracks generating increases due to lack of strength
Solution Approach 1:
The patent applies composite materials by combining the dielectric layers with the capacitive element through mechanical interlocking of protrusions and recesses. This composite structure creates a unified load-bearing system where the dielectric layers actively contribute to crack prevention, enabling the capacitor body to maintain high strength despite reduced height and achieve a more compact form factor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively compensates for the lack of strength in the capacitor body by preventing gap formation and ensuring high-strength connections, even when subjected to forces that could cause warping, while avoiding obstructions during mounting.
Implementation Method 1
the two first base conductor films, and the supplementary dielectric layer, on at least one height-direction face of the capacitive element, are connected to each other based on mutual bonding of the dielectric particles contained in each of them
Data Source
AI summary
In an embodiment, a multilayer ceramic capacitor 10 is such that: the two first base conductor films 11c, and the supplementary dielectric layer 11d, on each of both height-direction faces of the capacitive element 11′, are connected to each other based on mutual bonding of the dielectric particles contained in each of them; the two first base conductor films 11c on each of both height-direction faces of the capacitive element 11′, and the capacitive element 11′, are connected to each other based on mutual bonding of the dielectric particles contained in each of them; and the supplementary dielectric layer 11d on each of both height-direction faces of the capacitive element 11′, are the capacitive element 11′, are connected to each other based on mutual bonding of the dielectric particles contained in each of them.