Curved Side Margin Structure in MLCCs for Moisture Resistance
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Solution Overview
Problem
Existing multilayer ceramic capacitors face issues with moisture penetration and plating solution penetration through the interface joint between the body and side margin portions, leading to reduced lifespan and defects, particularly in ultra-small and high-capacitance products.
Innovation Solution
The multilayer electronic component features a design with side margin portions that include extension portions with curvature, covered by an external electrode layer, ensuring a thickness ratio of the side margin portion to the radius of curvature satisfies 1.1<R/WM0<2, effectively preventing external moisture and plating solution penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the internal electrode is manufactured to be exposed in the width direction to maximize the effective electrode area, then the capacitance per unit volume is improved, but moisture and plating solution can penetrate through the interface joint between the body and side margin portion, causing reliability degradation
Solution Approach 1:
The side margin portion is designed with a curved outer surface having a specific radius of curvature (R) relative to its thickness (WM0), where 0.05 ≤ R/WM0 ≤ 0.2. This curvature prevents capillary penetration of moisture and plating solution at the interface joint between the body and side margin portion, while maintaining the exposed internal electrode structure for high capacitance.
2Quantity of substance
If the side margin portion is separately attached to improve capacitance per unit volume, then the effective electrode area is maximized, but the interface joint becomes a penetration path for external moisture and plating solution
Solution Approach 1:
The curved outer surface of the side margin portion with controlled radius of curvature creates a geometric barrier that prevents capillary action of moisture and plating solution, eliminating the harmful effect of the interface joint while preserving the separate attachment structure for capacitance enhancement.
3Volume of moving object
If the multilayer electronic component is miniaturized, then the size is reduced for high output power applications, but the interface structure becomes more susceptible to moisture penetration
Solution Approach 1:
The curved geometry of the side margin portion provides effective moisture protection even in miniaturized components by creating a capillary barrier that is independent of overall component size, allowing continued miniaturization while maintaining reliability.
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately arranged in a first direction and cover portions disposed on the capacitance formation portion in the first direction, first to sixth surfaces; external electrodes disposed on the third and fourth surfaces; side margin portions disposed on the fifth and sixth surfaces; and a first extension portion disposed to extend to portions of the first and second surfaces, and wherein at least a partial region of the first extension portion has a curvature, wherein when an average thickness of the side margin portion is WM0 and a radius of curvature of at least a portion of the first extension portion is R, WM0 and R may satisfy 1.1<R/WM0<2.