Multilayer Ceramic Capacitor Electrode Structure for Low ESR

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Solution Overview

Problem

Multilayer ceramic capacitors with epoxy-based thermosetting resin layers between electrode layers and Ni plated layers exhibit high contact resistance, leading to high ESR and reduced mechanical strength.

Innovation Solution

A multilayer ceramic capacitor design featuring a base electrode layer, an electrically conductive resin layer with metal fillers, a Ni plated layer, and a Sn plated layer, where Ni is provided on the surface of the metal fillers, enhancing electrical connectivity and mechanical strength while reducing ESR.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an epoxy-based thermosetting resin layer is formed between the electrode layer and the Ni plated layer, then mechanical strength and crack resistance are improved, but contact resistance increases leading to high ESR

Engineering Contradiction:
Improvemechanical strengthVSAvoidcontact resistance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent uses a composite structure consisting of an epoxy-based thermosetting resin layer combined with a metal powder layer. The metal powder layer (containing Ni, Cu, or Ag) is positioned between the electrode layer and the Ni plated layer, creating a composite electrode structure that leverages both the mechanical strength of the resin and the electrical conductivity of the metal powder to achieve improved adhesion while maintaining low contact resistance

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The metal powder layer acts as an intermediary layer between the epoxy-based thermosetting resin layer and the Ni plated layer. This intermediate metal powder layer provides a conductive pathway that bridges the insulating resin layer and the plated layer, enabling electrical connection while the resin layer provides mechanical bonding, thus resolving the contradiction between mechanical strength and electrical conductivity

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves high mechanical strength and reduced ESR, improving the capacitor's durability and performance under severe environmental conditions.

Implementation Method 1

a Ni plated layer on the electrically conductive resin layer, and a Sn plated layer on the Ni plated layer; and Ni, which is a component of the Ni plated layer, is provided on at least a portion of a surface of the metal filler

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentEP4651164A1Multilayer ceramic capacitor
Publication Date: 2025.11.19 MURATA MFG CO LTD
  • EP4651164A1 patent drawingFigure 1
  • EP4651164A1 patent drawingFigure 2
  • EP4651164A1 patent drawingFigure 3

AI summary

The present invention provides a multilayer ceramic capacitor that has high mechanical strength and reduced ESR. A multilayer ceramic capacitor 1 comprises: a laminate 2; a first internal electrode layer 6a that is disposed on a plurality of dielectric layers 5 and that is exposed at a first end surface E1; a second internal electrode layer 6b that is disposed on the plurality of dielectric layers 5 and that is exposed at a second end surface E2; a first external electrode 20a that is disposed on the first end surface E1; and a second external electrode 20b that is disposed on the second end surface E2. The first external electrode 20a and the second external electrode 20b have: a conductive resin layer 22 that has an underlayer electrode layer 21 which includes a metal component and a thermosetting resin 38 and a metal filler 30 which are disposed on the underlayer electrode layer 21; a Ni plating layer 23 that is disposed on the conductive resin layer 22; and a Sn plating layer 24 that is disposed on the Ni plating layer 23. Disposed on at least a part of a surface of the metal filler 30 is Ni, which is a component of the Ni plating layer 23.