Multilayer Ceramic Capacitor Electrodes With Ni-Sn Gap Suppression
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Solution Overview
Problem
Multilayer ceramic capacitors with electrically conductive pastes containing ceramic powder for external electrodes face issues with gap formation due to suppressed metal densification, leading to insulation deterioration from moisture infiltration.
Innovation Solution
Incorporating Ni and Sn as metal components in the external electrode layers, with Sn as a sub-component to alloy with Ni, forming a densified structure that prevents gap formation and enhances sinterability, thereby reducing moisture infiltration and improving insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ceramic powder is dispersed in the electrically conductive paste for the external electrode, then the adhesiveness between the external electrode and ceramic body is improved, but the metal densification is suppressed and gaps are more likely to occur
Solution Approach 1:
The invention changes the chemical composition parameters of the electrically conductive paste by specifying precise ratios of Ni powder (70-90 wt%), Sn powder (5-20 wt%), and ceramic powder (1-10 wt%). This parameter optimization allows the paste to achieve both good adhesiveness to the ceramic body and sufficient metal densification after sintering, resolving the contradiction between these two requirements.
2Reliability
If ceramic powder is dispersed in the electrically conductive paste, then the external electrode structure is enhanced, but moisture infiltration occurs through gaps causing insulation deterioration
Solution Approach 1:
By optimizing the composition parameters (Ni: 70-90 wt%, Sn: 5-20 wt%, ceramic powder: 1-10 wt%) and controlling the sintering process, the invention achieves dense metal structure that prevents moisture infiltration pathways, thereby maintaining insulation properties while incorporating ceramic powder for structural enhancement.
Solution Approach 2:
The invention creates a composite electrically conductive paste material combining Ni powder, Sn powder, and ceramic powder in specific ratios. This composite structure provides both the mechanical adhesion benefits of ceramic particles and the electrical conductivity and densification capabilities of the metal powder matrix, preventing moisture infiltration while enhancing overall reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloyed Ni and Sn in the external electrode layers effectively prevent gap formation and moisture infiltration, enhancing the reliability and insulation properties of multilayer ceramic capacitors, especially under severe environmental conditions.
Implementation Method 1
each include an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component
Implementation Method 2
enhancing the reliability and insulation properties multilayer ceramic capacitors, especially under severe environmental conditions
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.