Multilayer Capacitor Grain Gradients for Breakdown Reliability
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Solution Overview
Problem
The miniaturization of multilayer ceramic capacitors to increase capacitance while maintaining reliability and improving breakdown voltage and high-temperature lifespan characteristics is challenging due to the decreased thickness of internal electrodes and dielectric layers, which can lead to reliability issues and capacitance dispersion.
Innovation Solution
A multilayer electronic component design with specific ratios of average dielectric grain sizes at different positions, including a central portion, boundary portions, and cover portions, to control internal stress and stress distribution, along with side margin portions to prevent physical or chemical damage, ensuring uniform microstructure and enhanced capacitance, breakdown voltage, and high-temperature performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thicknesses of internal electrode and dielectric layer are decreased to miniaturize the capacitor and increase capacitance, then the size is reduced and capacitance is increased, but reliability is decreased
Solution Approach 1:
The patent applies local quality by creating distinct regions with different dielectric grain sizes within the capacitor body. The central portion has a first average dielectric grain size, while the outer portion has a second average dielectric grain size that is smaller than the first. This spatial variation in grain size distribution allows different regions to serve different functions: the central region provides mechanical strength and stress distribution, while the outer region ensures reliable electrode connection and capacitance formation, thereby maintaining overall reliability even with reduced thickness.
2Quantity of substance
If the thicknesses of internal electrode and dielectric layer are decreased to increase capacitance, then capacitance is increased, but breakdown voltage characteristics are worsened
Solution Approach 1:
The patent implements local quality by establishing a gradient in dielectric grain sizes where the central portion has larger grains and the outer portion has smaller grains. This spatial differentiation optimizes breakdown voltage characteristics by ensuring that the region closest to the electrodes (outer portion) has finer grains that provide better electrical insulation and higher breakdown voltage, while the central region with larger grains maintains mechanical integrity and stress distribution capability.
3Volume of moving object
If the thicknesses of internal electrode and dielectric layer are decreased to miniaturize the capacitor, then size is reduced, but capacitance dispersion increases
Solution Approach 1:
The patent applies local quality by creating a controlled spatial distribution of dielectric grain sizes throughout the capacitor body. The central portion with larger average grain size provides stable capacitance characteristics, while the outer portion with smaller average grain size ensures uniform electrical properties near the electrodes. This deliberate spatial variation in grain structure reduces capacitance dispersion by ensuring consistent electrical behavior across different regions of the miniaturized capacitor.
Data Source
AI summary
A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.