Multilayer Ceramic Capacitor Grain Growth for Thin-Margin Strength

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Solution Overview

Problem

Multi-layer ceramic capacitors face reduced mechanical strength due to thinner margins, compromising reliability as they miniaturize and increase in capacitance.

Innovation Solution

Incorporating a grain growth region with larger crystal grains at the boundary between the cover and side margin, which reduces crack initiation points and enhances mechanical strength, allowing for thinner circumferential units while maintaining reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the thickness of the margin around the internal electrodes is made thinner to achieve miniaturization and increased capacitance, then the capacitance and miniaturization are improved, but the mechanical strength with respect to external force is reduced

Engineering Contradiction:
ImprovecapacitanceVSAvoidmechanical strength
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The patent applies local quality by creating a grain growth region with larger crystal grains specifically at the boundary between the cover and side margin, while maintaining thinner margins elsewhere. This localized structural modification enhances mechanical strength at the critical boundary region without increasing the overall margin thickness, thus resolving the contradiction between miniaturization and mechanical strength.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the physical parameter of crystal grain size in a localized manner. By increasing the crystal grain size in the grain growth region at the cover-side margin boundary, the mechanical strength is enhanced without compromising the miniaturization goal. This parameter change allows the margin to be both thin and strong.

Inventive Principle:
Principle #35Parameter changes

2Volume of moving object

If the circumferential unit is made thinner to achieve miniaturization, then the size is reduced, but the mechanical strength and reliability are compromised

Engineering Contradiction:
ImprovesizeVSAvoidreliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent creates a localized grain growth region at the boundary between the cover and side margin within the circumferential unit. This local structural enhancement provides improved mechanical strength and crack resistance at the critical boundary region, allowing the overall circumferential unit to remain thin while maintaining reliability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The grain growth region is formed in advance during the sintering process, creating a pre-reinforced structure at the boundary region before the component is subjected to external forces or environmental conditions. This preliminary strengthening ensures reliability from the outset while maintaining the thin-profile design.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multi-layer ceramic electronic component achieves enhanced mechanical strength and reliability, enabling miniaturization and increased capacitance without compromising insulation properties or environmental resistance.

Implementation Method 1

The grain growth region is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover

Methodology Applied
Scientific EffectGrain growth:

Data Source

PatentUS11830679B2Multi-layer ceramic electronic component
Publication Date: 2023.11.28 TAIYO YUDEN KK
  • US11830679B2 patent drawing
  • US11830679B2 patent drawing
  • US11830679B2 patent drawing

AI summary

A multi-layer ceramic electronic component, including: a capacitance forming unit that includes internal electrodes and ceramic layers, the internal electrodes being laminated in a first direction via the ceramic layers; and a circumferential unit that is provided on a circumference of the capacitance forming unit and formed of insulating ceramics. The circumferential unit includes a cover that is provided to the capacitance forming unit outward in the first direction, a side margin that is provided to the capacitance forming unit outward in a second direction orthogonal to the first direction, and a grain growth region that is formed at a boundary between the cover and the side margin and includes crystal grains of the insulating ceramics, the crystal grains having a mean grain size larger than a mean grain size of the crystal grains at a center portion of the cover.