Multilayer Ceramic Capacitor Interposer Cushioning Against Cracks
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Solution Overview
Problem
Multilayer ceramic capacitors experience stress concentration and potential cracking due to contact with an interposer when subjected to bending or other factors, leading to structural integrity issues.
Innovation Solution
Incorporation of an insulating resin film between the board mounting surface and the interposer-facing surface of the capacitor main body, which prevents direct contact and reduces stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is provided on the board mounting surface to reduce acoustic noise, then acoustic noise is reduced or prevented, but stress concentration occurs in the contact portion between the interposer and capacitor main body, leading to potential cracks
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the interposer and the capacitor main body. This resin layer acts as a stress-distributing medium that prevents direct contact between the rigid interposer and the ceramic capacitor body, thereby eliminating stress concentration while maintaining the acoustic noise reduction function of the interposer.
Solution Approach 2:
The resin layer is applied in advance on the board mounting surface before mounting the capacitor main body. This pre-applied cushioning layer anticipates and prevents the stress concentration problem that would otherwise occur during operation, protecting the capacitor body from potential cracks before they can happen.
2Stability of the object's composition
If the interposer directly contacts the capacitor main body to provide support, then mounting stability is improved, but stress concentration occurs leading to reduced reliability
Solution Approach 1:
The resin layer serves as a mediator that maintains the stabilizing function of the interposer while eliminating the harmful stress concentration. The resin provides a compliant interface that allows the interposer to hold the capacitor in place without transmitting damaging point loads to the ceramic body.
Solution Approach 2:
The introduction of the resin layer changes the physical parameters of the contact interface from rigid-to-rigid contact to rigid-to-compliant contact. This parameter change in material compliance allows the system to maintain mounting stability while distributing stress over a larger area, preventing crack formation.
Data Source
AI summary
A multilayer ceramic capacitor includes a capacitor main body including a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and external electrodes respectively on two end surfaces of the multilayer body and connected to the internal electrode layers, an interposer at a board mounting surface of the capacitor main body, and an insulating resin film in a gap between the board mounting surface and a capacitor-facing surface of the interposer which is opposed to the board mounting surface.