Multilayer Ceramic Capacitor Interposer for Crack-Resistant Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors are prone to stress concentration and cracking when mounted on a board due to bending or other factors, as the interposer can concentrate stress at the contact point, leading to potential cracks in the capacitor main body.
Innovation Solution
Incorporating an insulating resin film in the gap between the board mounting surface and the capacitor-facing surface of the interposer, which reduces stress concentration by preventing direct contact between the interposer's corner and the capacitor main body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is provided on the board mounting surface of the capacitor main body, then acoustic noise is reduced or prevented, but stress concentration occurs at the contact portion between the interposer and capacitor main body, leading to potential cracks
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the interposer and the capacitor main body. This resin layer acts as a stress-distributing medium that prevents direct contact between the rigid interposer and the ceramic capacitor body, thereby eliminating stress concentration while maintaining the acoustic noise reduction function of the interposer.
Solution Approach 2:
The physical state and mechanical properties at the contact interface are changed by introducing a compliant resin layer. This resin layer has different mechanical parameters (softer, more compliant) compared to the rigid interposer and ceramic body, allowing it to absorb and distribute stress rather than concentrate it, while still providing the necessary acoustic isolation.
2Stability of the object's composition
If the interposer directly contacts the capacitor main body, then mounting stability is improved, but the capacitor main body is prone to cracking under bending stress
Solution Approach 1:
The resin layer serves as a mediator that maintains the mechanical connection between the interposer and capacitor main body while preventing direct stress transfer. This intermediary layer ensures mounting stability through adhesion while protecting against crack formation by distributing mechanical loads.
Solution Approach 2:
The resin layer is applied beforehand as a protective cushioning layer between the interposer and capacitor main body. This pre-applied layer anticipates and prevents potential cracking by providing stress distribution before any bending or mechanical stress is applied to the mounted capacitor.
Data Source
AI summary
A multilayer ceramic capacitor includes a capacitor main body including a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and external electrodes respectively on two end surfaces of the multilayer body and connected to the internal electrode layers, an interposer at a board mounting surface of the capacitor main body, and an insulating resin film in a gap between the board mounting surface and a capacitor-facing surface of the interposer which is opposed to the board mounting surface.