Multilayer Ceramic Capacitor Interposer Grooves Noise Reduction
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Solution Overview
Problem
The increasing demand for miniaturization in electronic devices has led to a need for effective reduction of acoustic noise in multilayer ceramic capacitors, which are prone to vibration-induced noise due to their piezoelectric properties, especially in smaller sizes such as 0804 or less, where existing solutions like interposers are inadequate.
Innovation Solution
The proposed solution involves a multilayer ceramic capacitor with an interposer having grooves and external terminals that are precisely aligned to minimize acoustic noise, with specific alignment ratios (ΔL/L ≤ 0.100 and ΔW/W ≤ 0.167) to effectively reduce vibrations, and the use of conductive adhesive portions and plating layers for improved bonding and noise reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an interposer is disposed between the multilayer ceramic capacitor and the board to reduce vibration sound, then acoustic noise is reduced, but the device size increases and miniaturization is compromised
Solution Approach 1:
The interposer is segmented with grooves formed in its upper and lower surfaces, dividing the solid structure into sections. This segmentation reduces the interposer's overall volume while maintaining its noise reduction function through the distributed groove structure that interferes with vibration transmission
Solution Approach 2:
The grooves are strategically positioned at specific locations on the interposer surfaces to create local variations in structural properties. These localized features target specific vibration modes and frequencies, providing effective noise reduction at critical points without requiring the entire interposer to be large
2Volume of moving object
If the multilayer ceramic capacitor is miniaturized to meet device size requirements, then device compactness is improved, but acoustic noise reduction effectiveness deteriorates
Solution Approach 1:
The grooves extend in the thickness direction of the interposer, utilizing the Z-dimension to create vibration-dampening features. This vertical dimensionality allows effective noise reduction without increasing the capacitor's planar footprint (L and W dimensions), enabling miniaturization while maintaining acoustic performance
3Object-affected harmful factors
If precise alignment between the interposer and capacitor is achieved to minimize acoustic noise, then noise reduction effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The grooves are positioned asymmetrically or at specific non-uniform locations on the interposer surfaces, creating a unique alignment reference pattern. This asymmetric configuration provides built-in alignment cues that guide precise positioning during assembly, reducing the need for high-precision manufacturing tolerances while maintaining effective noise reduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a significant reduction in acoustic noise, maintaining the noise level within acceptable limits even in capacitors with small sizes, by optimizing the alignment and bonding precision between the capacitor and interposer, thereby addressing the challenge of noise reduction in miniaturized electronic components.
Implementation Method 1
Since the ferroelectric material has piezoelectric characteristics, when a direct current (DC) or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes to generate periodic vibrations, while expanding and contracting a capacitor body depending on a frequency.
Implementation Method 2
an interposer including an interposer body having grooves in opposite surfaces thereof, respectively
Data Source
AI summary
An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ΔL=|A-A′|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A′ is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ΔL is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ΔL/L≤0.100 in which L is a length of the multilayer ceramic capacitor.