Perpendicular-Layer MLCC Layout to Prevent Capacitive Howling
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Solution Overview
Problem
The piezoelectric effect in MLCCs causes deformation leading to collisions with the PCB, resulting in audible 'capacitive howling' and deformation of the circuit board, affecting device performance and reliability.
Innovation Solution
The MLCC design features ceramic medium layers and inner electrodes perpendicular to the circuit board surface, aligning deformation parallel to the board surface to prevent collisions and 'capacitive howling', with direct mounting for improved stability and space efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the MLCC is mounted with ceramic medium layers parallel to the circuit board surface, then the MLCC can be easily mounted, but the piezoelectric effect causes deformation perpendicular to the board surface leading to collisions and capacitive howling
Solution Approach 1:
The patent changes the orientation of the ceramic medium layers from parallel to perpendicular relative to the circuit board surface. This dimensional reorientation shifts the deformation direction caused by the piezoelectric effect from the vertical axis (perpendicular to board) to the horizontal axis (parallel to board), eliminating collisions with the board surface that cause capacitive howling while maintaining mounting simplicity
2Ease of manufacture
If the MLCC is mounted with ceramic medium layers parallel to the circuit board surface, then the mounting process is simple, but the circuit board deforms due to collision forces
Solution Approach 1:
By reorienting the ceramic medium layers perpendicular to the circuit board surface, the patent redirects the piezoelectric deformation forces from the vertical dimension (affecting board stability) to the horizontal dimension (parallel to board surface). This eliminates the collision mechanism that causes board deformation while preserving the simplicity of the mounting process
3Reliability
If the MLCC uses conventional orientation, then the deformation direction is perpendicular to the board surface causing collisions, but changing orientation may affect electrical connection
Solution Approach 1:
The patent reorients the ceramic medium layers perpendicular to the circuit board, which changes the deformation direction to be parallel to the board surface. The outer electrodes are positioned on the side surfaces of the ceramic body to maintain electrical connection with the circuit board in this new orientation, thus preventing collisions while preserving electrical functionality
Solution Approach 2:
The outer electrodes are specifically positioned on the side surfaces of the ceramic body rather than on the top and bottom surfaces. This local repositioning of the electrical connection points adapts to the new perpendicular orientation of the ceramic layers, ensuring reliable electrical connection while maintaining the deformation direction parallel to the board surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents 'capacitive howling' and ensures circuit board stability, enhancing device performance and reliability, particularly in radio frequency operations, while optimizing space and reducing production complexity.
Implementation Method 1
A piezoelectric ceramic chip is a piezoelectric material having a piezoelectric effect... Because of a piezoelectric effect of an MLCC, when a voltage applied to the MLCC changes, the MLCC deforms
Data Source
AI summary
A multi-layer ceramic capacitor (MLCC), a method for manufacturing an MLCC, a circuit board assembly, and an electronic device. An MLCC makes each ceramic medium layer and each inner electrode in a ceramic body perpendicular to a board surface of a circuit board, so that a deformation direction of the MLCC is parallel to the board surface of the circuit board, the MLCC does not collide with the circuit board, and a phenomenon of “capacitive howling” does not occur. This can improve a use effect of an electronic device, and can especially improve use experience of the electronic device in a radio frequency transmission and reception process (for example, a call process).