Multilayer Ceramic Capacitor Mounting Structure for Thin, Strong Assembly
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Solution Overview
Problem
The reduction in size and thickness of multilayer ceramic capacitors has led to a decrease in flexural strength and increased mounting thickness, making it challenging to provide sufficient strength and reduce mounting thickness simultaneously.
Innovation Solution
A mounting structure for multilayer ceramic capacitors with a laminate design that includes dielectric and internal electrode layers, via conductors connecting external electrodes, and a specific geometry that prevents external electrodes from extending to the side surfaces, allowing for high flexural strength and reduced mounting thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of multilayer ceramic capacitors is reduced, then the size of electronic devices can be reduced, but the flexural strength of the capacitors decreases
Solution Approach 1:
The patent changes the configuration of external electrodes from extending to side surfaces (conventional) to being positioned only on main surfaces (invention). This dimensional repositioning reduces the mounting thickness footprint while maintaining structural integrity through via conductors that penetrate the laminate, resolving the contradiction between reduced thickness and maintained strength.
2Reliability
If external electrodes extend to the side surfaces of the laminate, then electrical connection is established, but the mounting thickness increases
Solution Approach 1:
The patent extracts the external electrodes from the side surfaces of the laminate, removing them from positions that会增加 mounting thickness. Electrical connection is maintained through via conductors that penetrate the laminate and connect internal electrode layers to external electrodes positioned only on main surfaces, thus reducing mounting thickness while preserving electrical connectivity.
Solution Approach 2:
The patent introduces via conductors as intermediary elements that penetrate the laminate to establish electrical connection between internal electrode layers and external electrodes. This mediator approach allows external electrodes to be positioned on main surfaces only, reducing mounting thickness while maintaining reliable electrical connection through the via conductor pathway.
3Reliability
If conventional solder mounting with conductive solder paste is used, then electrical connection is established, but the mounting thickness is larger compared to flux mounting
Solution Approach 1:
The patent changes the mounting method parameter from solder mounting with conductive paste to flux mounting with thermosetting resin. This parameter change reduces mounting thickness because flux mounting uses the melt of external electrodes to connect lands directly, eliminating the need for additional solder paste thickness. The invention's electrode configuration works optimally with this mounting method to achieve reduced mounting thickness.
Data Source
AI summary
A mounting structure of a multilayer ceramic capacitor includes a substrate, and a multilayer ceramic capacitor connected to the substrate and including a laminate including dielectric layers and internal electrode layers, and external electrodes on main surfaces of the laminate. The laminate further includes first, second, third, and fourth via conductors connecting the internal electrode layers and the external electrodes. The external electrodes include first, second, third, and fourth external electrodes, each connected to respective end surfaces of the via conductor. Each of the external electrodes does not extend to the side surfaces of the laminate. A ratio W/L of a dimension W in the width direction of the multilayer ceramic capacitor to a dimension L in the length direction of the multilayer ceramic capacitor is about 0.85 or more and about 1 or less.