Ni-Cu Alloy Internal Electrode for MLCC Moisture Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining chip strength and moisture resistance due to thinning internal electrodes, which increases the risk of electrode disconnection and permeation.
Innovation Solution
Incorporating an internal electrode with an alloy region and an alloying element region, where the alloying element is primarily composed of elements like silicon, aluminum, or copper, to fill disconnected portions and enhance connectivity, thereby improving chip strength and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of laminated layers is increased to increase capacitance, then the capacitance is improved, but the internal electrode thickness must be reduced which leads to increased electrode disconnection and reduced chip strength
Solution Approach 1:
The patent changes the chemical composition parameters of the internal electrode by adding alloying elements (such as Cu, Ag, Au, or their combinations) to the Ni-based internal electrode. This parameter change allows the electrode to maintain connectivity even when thinned, resolving the contradiction between increased layer count (for higher capacitance) and electrode thickness (for connectivity).
Solution Approach 2:
The patent creates a composite material system by combining Ni with alloying elements (Cu, Ag, Au, etc.) to form an alloyed internal electrode. This composite structure provides both the electrical conductivity needed for connectivity and the mechanical strength required to prevent disconnection in thinned electrodes with increased layer counts.
2Quantity of substance
If the internal electrode is thinned to increase the number of laminated layers, then the capacitance is improved, but the chip strength is reduced and vulnerability to moisture permeation increases
Solution Approach 1:
The patent modifies the compositional parameters of the internal electrode by incorporating alloying elements (Cu, Ag, Au, or combinations) into the Ni-based electrode material. This parameter change enhances the mechanical strength and moisture resistance of thinned electrodes, allowing increased layer counts without sacrificing chip strength.
Solution Approach 2:
The patent develops a composite electrode material consisting of Ni combined with alloying elements (Cu, Ag, Au, etc.). This composite structure provides improved mechanical properties and moisture resistance, enabling the use of thinned electrodes in high-layer-count capacitors while maintaining chip strength.
3Quantity of substance
If the internal electrode is thinned to increase the number of laminated layers, then the capacitance is improved, but the vulnerability to moisture permeation is increased
Solution Approach 1:
The patent changes the chemical composition parameters of the internal electrode by adding alloying elements (Cu, Ag, Au, or their combinations) to the Ni-based electrode. This compositional modification creates a more moisture-resistant electrode structure that prevents moisture permeation even when the electrode is thinned to accommodate increased layer counts.
Solution Approach 2:
The patent creates a composite electrode material system by alloying Ni with elements such as Cu, Ag, Au, or their combinations. This composite structure provides enhanced barrier properties against moisture permeation, allowing thinned electrodes in high-capacitance, multi-layer configurations to resist moisture intrusion.
Data Source
AI summary
A capacitor component includes a body including a dielectric layer and an internal electrode, the internal electrode including nickel and an alloying element, and an external electrode disposed on the body to be connected to the internal electrode. The internal electrode includes an alloy region and an alloying element region.