Multilayer Ceramic Capacitor Protective Electrode Patterns
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in maintaining high capacity and reliability while being miniaturized, often experiencing deformation and short-circuits due to the pressure applied during via formation, which affects their performance and reliability.
Innovation Solution
The design incorporates a protective layer with spaced-apart electrode patterns on the surface of the capacitive portion, preventing deformation by suppressing the downward push of the dielectric layer during via formation and enhancing capacitance through a bottom electrode structure with connecting electrodes that penetrate through the protective and capacitive portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the capacitor is miniaturized to reduce size and thickness, then the device dimensions are reduced, but the internal electrodes become more susceptible to deformation and short-circuits during via formation
Solution Approach 1:
A protective part comprising a dielectric layer and electrode patterns is formed on the surface of the capacitive portion before via formation. This protective structure acts as a cushion that prevents the downward push of the dielectric layer during via drilling, thereby preventing internal electrode deformation and short-circuits in miniaturized capacitors
Solution Approach 2:
The capacitor is divided into distinct functional parts: a capacitive portion with internal electrodes, a protective part with electrode patterns, and connecting electrodes. This segmentation allows the protective part to specifically address the deformation issue without affecting the capacitive function of the internal electrodes
2Reliability
If a protective part with electrode patterns is added to prevent deformation, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The protective part is integrated with the capacitive portion through co-sintering, and the electrode patterns in the protective part are electrically connected to the internal electrodes via connecting electrodes. This merging approach combines protection and electrical connection functions into a unified structure, reducing overall device complexity despite adding protective functionality
3Quantity of substance
If the overlapping area of internal electrodes is maximized to increase capacitance, then the capacity is improved, but the device becomes more prone to deformation during manufacturing
Solution Approach 1:
The protective part with electrode patterns is formed beforehand on the capacitive portion. This protective structure prevents dielectric layer push and internal electrode deformation during via formation, enabling larger overlapping areas to be maintained with improved manufacturing precision and reduced electrode misalignment
Data Source
AI summary
A multilayer ceramic capacitor includes a capacitive portion, a protective part, and first and second connecting electrodes. The capacitive portion includes a first dielectric layer and first and second internal electrodes disposed with the first dielectric layer interposed therebetween. The protective part is disposed on one surface of the capacitive portion and includes a second dielectric layer and first and second electrode patterns disposed to be spaced apart from each other. The first connecting electrode penetrates through the protective part and the capacitive portion and is connected to the first internal electrode and the first electrode pattern, and the second connecting electrode penetrates through the protective part and the capacitive portion and is connected to the second internal electrode and the second electrode pattern.