MLCC Side Margin Composition Gradient for Moisture Resistance
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Solution Overview
Problem
The existing methods for miniaturizing and increasing the capacitance of multilayer ceramic capacitors, such as exposing internal electrodes and attaching side margin portions, lead to decreased moisture resistance reliability and size differences between dielectric grains, compromising the reliability of the capacitors.
Innovation Solution
A multilayer electronic component design with side margin portions and external electrodes, where the dielectric layer and side margin portions include silicon (Si) with a higher average Si content in specific regions, and a ratio of average dielectric grain sizes between the active and side margin portions is controlled to be between 0.5 and 1.5, enhancing low-temperature compactness and reducing grain size differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the method of separately attaching side margin portions is used to miniaturize the multilayer ceramic capacitor and increase capacitance, then capacitance per unit volume is improved, but moisture resistance reliability is decreased
Solution Approach 1:
The patent applies local quality by creating a composition gradient in the side margin portion where Si content varies through the thickness direction. The first region (near the dielectric layer interface) has higher Si content to suppress grain growth and maintain moisture resistance, while the second region (outer region) has lower Si content to control overall capacitance. This spatial variation in material composition resolves the contradiction between capacitance enhancement and moisture resistance.
2Quantity of substance
If the method of separately attaching side margin portions is used, then capacitance per unit volume is improved, but the thickness of side margin portions is decreased
Solution Approach 1:
The patent applies parameter changes by controlling the Si content distribution through the thickness direction of the side margin portion. By adjusting the Si content in different regions (higher in the first region, lower in the second region), the patent optimizes both the grain size and moisture resistance properties despite the reduced thickness, thereby achieving high capacitance per unit volume without compromising structural integrity.
3Quantity of substance
If the method of separately attaching side margin portions is used, then capacitance per unit volume is improved, but the average size of dielectric grains in the side margin portion becomes greater than in the active portion, decreasing reliability
Solution Approach 1:
The patent applies local quality by creating a composition gradient in the side margin portion where Si content varies through the thickness direction. The first region (near the dielectric layer interface) has higher Si content to suppress grain growth and maintain moisture resistance, while the second region (outer region) has lower Si content to control overall capacitance. This spatial variation in material composition resolves the contradiction between capacitance enhancement and moisture resistance.
Solution Approach 2:
The patent applies parameter changes by controlling the Si content distribution through the thickness direction of the side margin portion. By adjusting the Si content in different regions (higher in the first region, lower in the second region), the patent optimizes both the grain size and moisture resistance properties despite the reduced thickness, thereby achieving high capacitance per unit volume without compromising structural integrity.
Data Source
AI summary
A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.