MLCC Side Margin Formation Without Chip Edge Stress
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Solution Overview
Problem
The existing methods for forming side margin portions in multilayer ceramic capacitors concentrate stress on the edges of unit chips, leading to damage and reduced manufacturing yield due to size distribution issues and rapid drying of ceramic green sheets, which affects adhesive force and reliability.
Innovation Solution
A method involving the stacking and cutting of ceramic green sheets on a support film, followed by separation and arrangement of unit chips without rotation, and attachment of ceramic green sheets for side margin portions to prevent stress concentration and ensure adequate adhesive force, thereby improving the reliability and yield of multilayer electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the tumbling method is used to expose side margin formation surfaces of multiple green chips, then the side surfaces can be uniformly opened, but strong shearing force causes stress concentration on chip edges leading to damage
Solution Approach 1:
The process is divided into two separate operations: first exposing side surfaces of odd-numbered chips, then exposing side surfaces of even-numbered chips. This segmentation eliminates the need for simultaneous tumbling of all chips, preventing stress concentration on chip edges while still achieving uniform side surface exposure across all chips.
2Productivity
If multiple green chips are simultaneously rotated during tumbling, then side surfaces can be exposed, but size distribution causes defects such as non-movement and non-rotation
Solution Approach 1:
The simultaneous rotation of all chips is segmented into sequential operations: odd-numbered chips are rotated and exposed first, then even-numbered chips are rotated and exposed. This eliminates the size distribution problems that occur when all chips are rotated simultaneously, ensuring consistent side surface exposure while maintaining productivity through batch processing.
3Productivity
If ceramic green sheet dries rapidly during punching, then the process can be completed quickly, but adhesive force of side margin portion is reduced
Solution Approach 1:
Adhesive ingredient is coated on the ceramic green sheet before the punching operation. This preliminary action ensures that the adhesive is already in place and can properly bond the side margin portion even if the green sheet experiences rapid drying during the punching process, maintaining both productivity and adhesive force.
4Reliability
If adhesive ingredient is coated on ceramic green sheet surface, then adhesive force can be secured, but the process complexity increases
Solution Approach 1:
The coating of adhesive ingredient is merged with the existing punching process flow. The adhesive coating is applied to the ceramic green sheet as part of the preparation sequence before punching, utilizing the same equipment and process infrastructure already in place, thereby securing adhesive force without significantly increasing overall process complexity.
Data Source
AI summary
A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.