Millimeter-Wave Antenna Bump Fixation for Module Compatibility
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Solution Overview
Problem
Existing millimeter-wave antenna devices face challenges with high signal transmission loss, precision limitations, and compatibility issues with external emitting/receiving modules due to strict alignment requirements and small antenna spacing, which hinder efficient production and functionality in 5G communication systems.
Innovation Solution
A millimeter-wave antenna device with a substrate featuring through holes and a microstrip antenna structure formed by two metal layers, coupled with coaxial cable connectors that use bump portions to secure the connectors in place, allowing for precise electrical connections and increased antenna spacing to accommodate external modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the antenna spacing is increased to accommodate external emitting/receiving modules, then the compatibility with external modules is improved, but the antenna array size increases
Solution Approach 1:
The patent transitions from planar antenna elements to three-dimensional waveguide antennas with vertical cavities. This dimensional change allows external modules to be positioned horizontally at the waveguide openings while maintaining compact overall array dimensions through the vertical stacking of waveguide structures.
Solution Approach 2:
The patent embeds the emitting/receiving modules within the waveguide cavity structures. The modules are positioned inside the cavities or at the waveguide openings, nesting them within the existing antenna structure rather than requiring separate external mounting space.
2Loss of energy
If the alignment precision between cavities and planar antenna elements is improved, then the signal transmission loss is reduced, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the cavity structure and the antenna element into a unified waveguide antenna assembly. The emitting/receiving modules are integrated within the waveguide cavities, eliminating the need for separate alignment between cavities and planar elements and reducing assembly complexity.
Solution Approach 2:
The waveguide structure serves as an intermediary that provides built-in alignment features and mechanical support. The waveguide cavities act as precise positioning structures that guide the placement of emitting/receiving modules, ensuring proper alignment without requiring high-precision external fixtures.
3Speed
If the antenna spacing is reduced to meet beam scan requirements, then the beam scanning performance is improved, but the installation of external emitting/receiving modules becomes difficult
Solution Approach 1:
The patent utilizes the vertical dimension of waveguide cavities to accommodate external modules. By positioning modules at the waveguide openings or within the vertical cavity space, the design maintains compact horizontal spacing for beam scanning while providing vertical clearance for module installation and access.
Data Source
AI summary
A millimeter-wave antenna device and a millimeter-wave antenna array device thereof are characterized in that bump portions on coaxial cable connector bases protrude into through holes of a millimeter-wave substrate to effectuate fixation thereof and ensure that the millimeter-wave substrate is tightly coupled to the coaxial cable connector bases to not only ensure the precision of the position of a feed impedance unit of a microstrip antenna structure but also ensure that, when fixed to an antenna back panel frame, a triangular configuration is effectuated such that larger antenna spacing (i.e., 8.5˜12 mm) is achieved while meeting the functional requirement of an antenna beam scan, that is, an allowance of ±30 degrees approximately, thereby circumventing a problem, i.e., the spacing between antenna units is too small to enable an external emitting/receiving module to function.