Test Kit Reflector for mmW Antenna Signal Coupling

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Solution Overview

Problem

Current semiconductor testing systems for millimeter wave (mmW) devices face challenges with longer test times and larger physical sizes, necessitating a more efficient and cost-effective solution for high-volume testing.

Innovation Solution

A test kit comprising a socket structure with a reflector and a plunge structure, including a socket housing, guide plate, heat sink, and pogo pins, designed to securely hold and test devices under test (DUTs) with integrated mmW antennas, utilizing a reflector to enhance RF signal reflection and reception, and vacuum gripping for precise placement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a traditional test system is used for mmW devices, then the device can be tested, but the test time is longer and the physical size is larger

Engineering Contradiction:
Improvetest timeVSAvoidtest time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The test system is divided into separate functional modules: a socket structure for electrical connection, a reflector for RF signal management, and a plunge structure for positioning. This segmentation allows each component to be optimized independently, reducing overall test time while maintaining functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The reflector is integrated within the socket structure, and the plunge structure is nested within the socket housing. This nesting eliminates the need for separate external components, reducing the physical footprint and test setup time while maintaining all necessary functions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If a traditional test system is used for mmW devices, then the device can be tested, but the physical size is larger

Engineering Contradiction:
Improvetesting capabilityVSAvoidphysical size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The electrical connection function (socket), RF signal reflection (reflector), and positioning function (plunge structure) are merged into a single integrated test kit assembly. This combination maintains full testing capability while significantly reducing the physical space required compared to traditional separate-component systems.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The reflector utilizes vertical space within the socket housing rather than requiring horizontal expansion. By positioning the reflector beneath the DUT in the vertical dimension, the system maintains RF signal management capability without increasing the horizontal footprint of the test apparatus.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves antenna coupling factor while maintaining impedance matching, reducing test time and physical size, and enabling efficient high-volume testing of mmW devices.

Implementation Method 1

The RF signal emitted from the antenna of the DUT is reflected by the reflector and a reflected RF signal is received by the antenna of the DUT

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

The guide plate comprises a heat sink... for mounting a surface-mounted device, SMD, connector of the DUT

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3885773B1Test kit for testing a device under test
Publication Date: 2024.05.22 MEDIATEK INC
  • EP3885773B1 patent drawingFigure 1
  • EP3885773B1 patent drawingFigure 2
  • EP3885773B1 patent drawingFigure 3

AI summary

A test kit for testing a device under test, DUT, (130) includes a socket structure for containing the DUT (130). The DUT includes an antenna (AT) and radiates a RF signal. The test kit further includes a reflector (230) having a lower surface (230b). The RF signal emitted from the antenna (AT) of the DUT (130) is reflected by the reflector (230) and a reflected RF signal is received by the antenna (AT) of the DUT (130).