Millimeter-Wave Antenna Module Layout for Higher Patch Power
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Solution Overview
Problem
Conventional antenna arrays for millimeter wave applications require expensive, low-yield circuit boards with unbalanced metal density and dielectric thickness, making them difficult to test and lacking regulatory compliance shielding.
Innovation Solution
The development of antenna modules that include a logic die, a radio frequency front-end (RFFE) die, and an antenna patch, where the RFFE die is closer to the antenna patch than the logic die, along with an antenna board and integrated circuit (IC) packages that can be separately fabricated and assembled, enhancing design freedom and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna arrays use traditional circuit boards with unbalanced metal density and dielectric thickness, then antenna functionality is achieved, but manufacturing cost increases, yield decreases, and regulatory compliance shielding is lacking
Solution Approach 1:
The antenna module is divided into separate components: an antenna board with antenna elements, a separate circuit board with integrated circuits, and a housing that provides shielding. This segmentation allows each component to be optimized independently - the housing can be designed specifically for regulatory compliance shielding without affecting the antenna or circuit board manufacturing
Solution Approach 2:
The housing acts as an intermediary structure that provides regulatory compliance shielding between the antenna elements and the external environment. It serves as a mediator that enables compliance without requiring modifications to the antenna or circuit board designs
2Reliability
If conventional antenna arrays use complex circuit boards with unbalanced metal density, then antenna performance is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The system separates antenna functions from circuit functions onto different boards. The antenna board contains only antenna elements with simplified structure, while the circuit board handles all electronic components. This segmentation reduces the complexity of each individual board while maintaining overall antenna performance
3Power
If RFFE die is placed closer to antenna patch than logic die, then power output to antenna patches increases by 2 dB to 3 dB, but device layout complexity increases
Solution Approach 1:
The patent utilizes the z-dimension (vertical stacking) to place the RFFE die closer to the antenna patch in the vertical direction rather than requiring lateral proximity in the x-y plane. This dimensional approach allows power efficiency improvements without increasing lateral layout complexity
Data Source
AI summary
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.