Mode Converter Pin Length via Laser Substrate Modification
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Solution Overview
Problem
Existing millimeter-wave communication module manufacturing techniques face challenges in achieving low reflection loss and optimal impedance matching due to discrete pin length adjustments and material limitations, leading to increased transmission loss and reduced frequency band availability.
Innovation Solution
A method for manufacturing a mode converter using a single glass substrate where the pin length is adjusted via laser modification, allowing for precise control and reducing the need for additional circuit elements, while also forming the grounding conductor layer and electromagnetic wave shielding portion simultaneously to enhance manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pin length is adjusted by laminating multiple substrates with predetermined thickness, then the converter can be manufactured, but the pin length is limited to discrete values and cannot be optimized for minimal reflection loss
Solution Approach 1:
The invention divides the substrate thickness adjustment into two segments: a base substrate with standard thickness and an additional substrate with variable thickness that is laser-modified. This segmentation allows the pin length to be precisely controlled by adjusting only the additional substrate's thickness rather than relying on laminating multiple substrates of fixed thicknesses.
Solution Approach 2:
The invention changes the thickness parameter of the additional substrate to achieve the desired pin length. By controlling the thickness of the additional substrate (which is laser-modified to form the pin), the pin length can be continuously adjusted to the optimal value for minimizing reflection loss, rather than being constrained to discrete values from substrate lamination.
2Reliability
If multiple substrates are laminated to form the pin, then the converter structure is established, but transmission loss increases due to adhesive layers and material variations between layers
Solution Approach 1:
The invention merges the pin formation and grounding conductor layer formation into a single substrate structure. The pin and grounding conductor layer are formed in the same additional substrate through laser modification, eliminating the need for multiple substrate laminations and adhesive layers, thereby reducing transmission loss.
Solution Approach 2:
The invention extracts the pin and grounding conductor layer formation from the multi-substrate lamination process. By forming these components within a single additional substrate using laser modification, the harmful adhesive layers and material interfaces between substrates are eliminated.
3Adaptability or versatility
If the pin length is adjusted by selecting different substrate thicknesses, then manufacturing is simplified, but the available frequency band is reduced due to limited optimization options
Solution Approach 1:
The invention changes the thickness parameter of the additional substrate to achieve the desired pin length. By controlling the thickness of the additional substrate (which is laser-modified to form the pin), the pin length can be continuously adjusted to the optimal value for minimizing reflection loss, rather than being constrained to discrete values from substrate lamination.
4Manufacturing precision
If substrate thicknesses are determined by material availability, then manufacturing is easier, but the pin length cannot be optimized for minimal reflection loss
Solution Approach 1:
The invention divides the substrate thickness adjustment into two segments: a base substrate with standard thickness and an additional substrate with variable thickness that is laser-modified. This segmentation allows the pin length to be precisely controlled by adjusting only the additional substrate's thickness rather than relying on laminating multiple substrates of fixed thicknesses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of a mode converter with adjustable pin length for low reflection loss and improved impedance matching, reducing manufacturing complexity and costs, and expanding the available frequency band.
Implementation Method 1
when a first modified portion is formed by irradiating a substrate with a laser beam
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface and has a predetermined depth, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface and is configured to transmit a high-frequency signal, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light and thereby forming a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion and thereby forming the micro hose; and filling the micro hole with a conductive material and thereby form the pin.