Modular Chip Card With Layered Conductor Overlap
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Solution Overview
Problem
The complexity of connecting conductor structures in chip cards, especially those with multiple substrate layers, increases production costs and complexity due to varying efficiency profiles, making it difficult to produce reliable chip cards efficiently.
Innovation Solution
A modular chip card design with standardized substrate layers and a connecting layer arrangement that allows for customizable connecting conductor configurations, where components and connecting layers have overlapping contact surfaces to simplify production and accommodate different efficiency profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a complex connecting conductor structure is used to accommodate multiple components with different efficiency profiles, then the chip card can support various functional configurations, but the production complexity and costs increase
Solution Approach 1:
The card body is divided into multiple substrate layers (first substrate layer, second substrate layer, third substrate layer) with components and connecting conductors distributed across different layers. This segmentation allows independent configuration of each layer to match different efficiency profiles while simplifying the overall production process.
Solution Approach 2:
The patent transitions from a planar connecting conductor structure to a three-dimensional layer structure. Connecting conductors are arranged in multiple layers with vertical connections (contact surfaces) between layers, enabling complex electrical connections to be achieved through spatial distribution rather than planar complexity.
2Adaptability or versatility
If the connecting conductor arrangement is frequently redesigned to match different efficiency profiles, then various chip card configurations can be achieved, but production costs and complexity increase
Solution Approach 1:
The standardized substrate layers are designed with universal features that can accommodate different component configurations. The same layer structure and connecting conductor patterns can be reused across different chip card types, requiring only selective assembly of layers rather than complete redesign for each efficiency profile.
Solution Approach 2:
Standardized substrate layers with pre-configured connecting conductors and contact surfaces are prepared in advance. These pre-fabricated layers can be stored and assembled according to different efficiency profiles, eliminating the need for frequent redesign and retooling during production.
3Device complexity
If multiple substrate layers are used to reduce connecting conductor complexity, then production is simplified, but ensuring reliable electrical contact between layers becomes more difficult
Solution Approach 1:
Contact surfaces between substrate layers are merged through lamination or bonding processes, creating direct electrical and mechanical connections. The connecting conductors from different layers are brought into contact through aligned contact surfaces, ensuring reliable electrical continuity while maintaining the benefits of layered structure.
Solution Approach 2:
The contact surfaces act as intermediary elements between connecting conductors on different substrate layers. These contact surfaces provide a standardized interface that facilitates reliable electrical connection while allowing independent optimization of each layer's connecting conductor layout.
Data Source
AI summary
The present invention relates to a chip card and a method for the production of a chip card having a chip (21) which is arranged in a card body, and having a plurality of components (18, 19, 22) being electrically conductively connected to the chip by means of a conductor arrangement (20), wherein the card body is composed of a plurality of substrate layers (11, 12, 13) which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (23, 24, 25, 26, 31, 32, 33, 34), which are disposed so as to overlap one another, for producing an electrically conductive contacting.