Modular Control Electronics Thermal Decoupling and EMC Shielding
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Solution Overview
Problem
Existing modular control electronics face challenges with electromagnetic compatibility (EMC) and cooling, as measures to improve EMC are ineffective, and components are sensitive to vibration and shock, with redundant power supply components and inefficient cooling connections.
Innovation Solution
A modular design where electrical components are arranged into separate modules based on thermal and EMC aspects, with a basic module providing intermediate circuit voltage to function modules, and EMC shielding and thermal decoupling to improve EMC and cooling efficiency, while minimizing heating between modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If subassemblies are built on separate printed circuit boards and plugged into a base support, then the control electronics can be compact and adaptable to different installation conditions, but electromagnetic compatibility (EMC) measures become ineffective and components become more sensitive to vibration and shock
Solution Approach 1:
The control electronics are divided into functionally related subassemblies, each built on separate printed circuit boards that are plugged into a base support. This segmentation allows compact design and adaptability to different installation conditions while maintaining the ability to implement EMC measures at the module level.
Solution Approach 2:
A base support structure is introduced as an intermediary between the subassemblies and the mounting surface. This base support provides a common reference plane for EMC shielding, grounding, and mechanical stability, while still allowing the subassemblies to be separately mounted and configured for different installation conditions.
2Ease of manufacture
If each printed circuit board has its own power supply and EMC components, then each board can be independently designed, but redundant components increase device complexity and space requirements
Solution Approach 1:
The base support is designed to provide common power supply distribution and EMC shielding for multiple subassemblies. Instead of each printed circuit board having separate power supply and EMC components, the base support serves as a universal platform that provides these functions for all connected subassemblies, reducing redundancy while maintaining independent board design capability.
3Volume of moving object
If components are arranged densely to save space, then the control electronics become compact, but cooling connections become insufficient and thermal management becomes difficult
Solution Approach 1:
The base support structure introduces a vertical dimension for thermal management by providing cooling channels and heat dissipation paths beneath and between the subassemblies. This allows efficient cooling connections without increasing the horizontal footprint, maintaining compact volume while improving cooling efficiency through three-dimensional thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances EMC and cooling efficiency, reduces component sensitivity to vibration and shock, and eliminates redundant power supply components, achieving a flexible and space-saving control electronics system.
Implementation Method 1
The electronic components of the basic module and the functional modules are also arranged separately from one another by thermal decoupling and/or EMC shielding
Implementation Method 2
The electronic components of the basic module and the functional modules are also arranged separately from one another by thermal decoupling and/or EMC shielding
Data Source
Figure 1
Figure 2~3
AI summary
The invention relates to control electronics in a modular design, comprising an electronic base module (10) and a plurality of functional modules (20), wherein: the base module (10) provides at least one one DC link voltage UZK at a voltage supply output for the voltage supply of the functional modules (20) and the functional modules (20) are electrically and mechanically connected to the base module (10) and are supplied with the DC link voltage UZK by the base module (10); the base module (10) and the functional modules (20) each have a carrier (12, 22) having electronic components (11, 21), the electronic components (11) of the base module producing the DC link voltage UZK, at least one functional module (20) being fastened to the carrier (12) of the base module (10); and the electronic components (11, 21) of the base module (10) and of the functional modules (20) are arranged separate from one another by means of a thermal decoupling and/or an EMC shield.