Modular Cooling System with Stackable Compartments for Electronic Heat Dissipation

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Solution Overview

Problem

Conventional cooling methods struggle to efficiently manage heat dissipation in complex and compact electronic components, often requiring complex plumbing installations that increase cost and maintenance complexity.

Innovation Solution

A modular and stackable cooling system where individual compartments house both electronic components and liquid coolant, eliminating the need for traditional plumbing through an elevation adjustment component and controlled fluid descent mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional cooling methods are used, then cooling function is provided, but spatial constraints and adaptability are worsened

Engineering Contradiction:

ImproveadaptabilityVSAvoidspatial constraints

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The cooling system is divided into multiple independent modular units, each capable of functioning autonomously. These modules can be stacked or arranged in different configurations to adapt to various spatial constraints and cooling requirements, eliminating the need for complex plumbing installations while maintaining effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The modular cooling modules are designed to be nested or stacked within each other, allowing compact arrangement that optimizes space utilization. This nesting approach enables the system to adapt to different spatial constraints while maintaining full cooling functionality across multiple levels or tiers.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Device complexity

If traditional plumbing installations are used, then coolant circulation is achieved, but device complexity and maintenance complexity increase

Engineering Contradiction:

Improvedevice complexityVSAvoidcost

Core Design Contradiction:

Device complexityVSEase of manufacture

Solution Approach 1:

The complex plumbing infrastructure is extracted and eliminated from the system. Instead of using traditional pipes and pumps for coolant circulation, each modular unit incorporates integrated coolant distribution mechanisms that simplify the overall system architecture, reduce manufacturing costs, and ease maintenance requirements.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Each modular cooling unit is designed to be self-sufficient, with built-in coolant circulation capabilities that eliminate the need for centralized plumbing systems. The modules can independently manage their own coolant flow and temperature control, reducing overall system complexity and maintenance burden.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The modular cooling system effectively addresses spatial constraints and adaptability needs, providing a cost-effective and efficient cooling solution by ensuring direct contact between components and coolant, and simplifying maintenance.

Implementation Method 1

individual compartments house both electronic components and liquid coolant, ensuring direct contact between components and coolant

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

eliminating the need for traditional plumbing through an elevation adjustment component and controlled fluid descent mechanism

Methodology Applied

Scientific EffectGravity: Gravitation

Data Source

PatentUS20250185212A1Modular Cooling Systems

Publication Date: 2025.06.05 CALARIS TECH

AI summary

Described herein are examples of cooling systems comprising a frame having first and second sides with respective stackable shelving modules. The frame supports customized arrangement of compartments for optimal electronic component cooling. The system includes first and second pluralities of compartments on respective shelving modules, where compartments are slidable, closable, and removable. Each compartment connects to a common trough or channel and includes an elevation adjustment component for controlled raising and lowering. Within each compartment, a compartment houses liquid coolant and electronic components, featuring an opening to the common trough, a base grate elevating the electronic component, and interconnect components at compartment corners securing to adjacent compartments. The system provides efficient cooling through modular design and controlled liquid coolant circulation.