Modular Cooling Device for Switch Cabinet Heat Distribution
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Solution Overview
Problem
Conventional cooling devices for heat-generating components in switch cabinets face inefficiencies in air throughput and energy consumption, leading to uneven temperature distribution and difficulties in arranging components due to inadequate cooling, especially when multiple components are densely packed.
Innovation Solution
A modular cooling device that supplies each heat-generating component with precisely the required amount of cooling medium through a customizable network of cooling tubes and outlet openings, adaptable to the component's geometry and heat generation, utilizing compressed air and temperature-controlled distribution for optimized cooling efficiency and reduced energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a central coolant supply or outlet is used for cooling heat-generating components in a housing, then the cooling device is simple in structure, but the cooling efficiency is insufficient and temperature distribution becomes uneven
Solution Approach 1:
The cooling device is segmented into multiple independent cooling circuits, each with its own coolant supply and outlet openings positioned near specific heat-generating components. This segmentation allows targeted cooling of different components with appropriate coolant flow rates, achieving uniform temperature distribution while maintaining reasonable structural complexity through modular design.
2Temperature
If air throughput is increased to cool all components in the housing, then the cooling effect is improved, but energy consumption increases
Solution Approach 1:
The cooling device implements local quality by providing customized cooling to different components based on their individual heat generation characteristics. Each component receives a tailored coolant flow rate through separately controlled supply openings, ensuring adequate cooling without the need to increase overall air throughput excessively, thereby reducing energy consumption while maintaining effective component cooling.
3Area of stationary object
If heat-generating components are densely arranged in a small area within the housing, then space utilization is improved, but heat dissipation becomes difficult
Solution Approach 1:
The cooling device uses segmented cooling circuits with multiple supply and outlet openings distributed throughout the housing to address densely arranged components. Each cooling circuit can be independently adjusted to provide sufficient coolant flow to specific high-heat-density areas, enabling effective heat dissipation even when components are densely packed, thus maintaining good heat dissipation efficiency while maximizing housing space utilization.
4Manufacturing precision
If the number and orientation of outlet openings are adapted to each component's geometry and heat generation, then cooling precision is improved, but device complexity increases
Solution Approach 1:
The cooling device achieves local quality by adapting the number, orientation, and positioning of outlet openings to match each component's specific geometry and heat generation characteristics. This customization allows precise cooling tailored to each component's thermal profile, achieving high cooling precision while the modular circuit design helps manage the inherent complexity through systematic configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures all components operate within permissible temperature limits with minimal cooling medium consumption, allowing for flexible component arrangement and reduced energy use, while enabling efficient heat dissipation and optimal positioning within the housing.
Implementation Method 1
As the air flows through the housing from the outside, it absorbs the heat generated by the components
Implementation Method 2
the distributor means (20) forming at least one flow channel (21) for the cooling medium
Data Source
Figure 1
Figure 2
AI summary
The invention relates to a cooling device (100) for heat-generating components (1) arranged in a housing (11), comprising a first device (101, 102), which is designed to conduct a cooling medium into the interior of the housing (11), and a second device (30), which is designed to conduct the cooling medium heated by the heat-generating components (1) away from the housing (11). The device according to the invention comprises distributing means (20) which are designed to supply the cooling medium to the heat-generating component (1) in the required quantity, depending on the heat generated by the heat-generating component (1).